The gradual evolution from hydro-pneumatic to electrical disposition of power in aircraft has
placed stringent requirements on the reliability of power electronic components in current …

Parameter changes in the complex internal structure of multi-layer 3D stacked chips will
greatly reduce the efficiency of modeling and thermal analysis. In this work, by combining …

This paper reports a distributed thermal monitoring scheme for power electronic modules
(PEMs) in wind turbine converters. The sensing system is based on utilizing electrically non …

With the development of high power converters, the safe operation of large IGBT modules
with parallel chips is of increasing importance. In a multichip module, uneven solder layer …

Solder degradation is still a main failure mechanism for power semiconductor modules. This
study proposes a monitoring method to detect the relative change in heat dissipation from a …

Assessing the health condition has a wide range of applications in healthcare, military,
aerospace, and industrial fields. Nevertheless, traditional feature-engineered techniques …

Asymmetric chip placement and initial die-attach defects within a multichip IGBT power
module (MIPM) can cause uneven junction temperature distribution and further accelerate …

Model predictive control (MPC) applications for multilevel power electronics converters are
often facing problems of a high computation burden. By using supervised imitation learning …

A parallel connection of electronic devices in the energy system is currently the only and the
most effective way to expand the power capacity. For a circuit containing loads, a minor …

Discrete power devices are used in a wide range of applications some of which would
benefit from device condition monitoring (CM). This article presents a data-driven method to …