Thickness is a typical parameter related to length, of which measurements are conducted in
various industrial fields, such as the automotive, aviation, ship-building, semiconductor, and …

In the field of dimensional metrology, significant technical challenges have been
encountered with regard to large-scale object assembly, satellite positioning, control of the …

Wafer-scale two-dimensional (2D) semiconductors with atomically thin layers are promising
materials for fabricating optic and photonic devices. Bright-field microscopy is a widely …

In this study, an optical system for simultaneous measurement of physical thickness, group
refractive index, bow, and warp of a large silicon wafer is first proposed based on a reflection …

Wavelength-tuning interferometry is commonly employed to measure the optical
homogeneity of parallel plates. However, the nonlinearity of phase shifts caused by …

We propose and realize a modified spectral-domain interferometer to measure the physical
thickness profile and group refractive index distribution of a large glass substrate …

We developed a method to measure the thickness profile and refractive index variation for
silicon wafers based on a spectral-domain interferometry. Through a spectral domain …

We developed an optical interferometric probe for measuring the geometrical thickness and
refractive index of silicon wafers based on a Fizeau-type spectral-domain interferometer, as …

An optical method to resolve the non-measurable thickness problem caused by the overlap
of optical path differences within a specific thickness range when measuring the physical …

A non-destructive method for measuring the physical thickness and group refractive index of
individual layers was proposed based on spectral-domain interferometry, which was …