[HTML][HTML] Microstructural and mechanical anisotropy in pressure-assisted sintered copper nanoparticles
The mechanical strength of sintered nanoparticles (NPs) limits their application in advanced
electronics packaging. In this study, we explore the anisotropy in the microstructure and …
electronics packaging. In this study, we explore the anisotropy in the microstructure and …
[HTML][HTML] Study on the melting and sintering behavior of Cu-Fe mixed nanoparticles based on molecular dynamics simulations
C Zhang, W Peng, Y Shao, M Oleksandr, L Lu… - Materials & Design, 2024 - Elsevier
Understanding the melting and sintering behavior of composite metal nanoparticles is of
great significance to promote the synthesis and application of nanomaterials. In this work …
great significance to promote the synthesis and application of nanomaterials. In this work …
[HTML][HTML] Atomic insights into the sintering behaviour of Ag–Cu solid solution nanoparticles on Ag substrate
Z Wen, W Liu, C Hang, R An, Y Tian - Journal of Materials Research and …, 2024 - Elsevier
In electronic packaging industry, it has been reported that compared with nano silver and
nano copper, the complementation and coordination of Ag and Cu components enable …
nano copper, the complementation and coordination of Ag and Cu components enable …
Rapid on-site nondestructive surface corrosion characterization of sintered nanocopper paste in power electronics packaging using hyperspectral imaging
W Chen, S Feng, X Liu, D Hu, X Zhu, Q Yao… - Microelectronics …, 2024 - Elsevier
Sintered nanocopper (nanoCu) paste, exhibiting excellent electrical, thermal, and
mechanical performances, offers promise for interconnections in wide bandgap (WBG) …
mechanical performances, offers promise for interconnections in wide bandgap (WBG) …
Molecular Dynamics Assisted Corrosion-Resistant Evaluation of Encapsulation Materials on Copper Used in Power Electronics Packaging
J Zhang, W Chen, H Tang, X Zhu… - 2024 25th …, 2024 - ieeexplore.ieee.org
Corrosion protection is one of the most important issues when copper is applied in power
electronics packaging as bonding wire, die attachment, interconnection, and DBC substrate …
electronics packaging as bonding wire, die attachment, interconnection, and DBC substrate …