Review of applications and developments of ultra-thin micro heat pipes for electronic cooling
The development of miniaturization and high-density packaging of electronic components
demands heat dissipation components that are compact and exhibit high performance. An …
demands heat dissipation components that are compact and exhibit high performance. An …
Advancements and challenges in ultra-thin vapor chambers for high-efficiency electronic thermal management: A comprehensive review
F Zhou, J Zhou, X Huai - International Journal of Heat and Mass Transfer, 2023 - Elsevier
Portable electronic products are continuously evolving towards compactness, integration,
and high performance, resulting in electronic chips generating significant heat in a confined …
and high performance, resulting in electronic chips generating significant heat in a confined …
[HTML][HTML] The utilization of selective laser melting technology on heat transfer devices for thermal energy conversion applications: A review
This paper reviews advanced heat transfer devices utilizing advanced manufacturing
technologies, including well-established thermal management applications. Several factors …
technologies, including well-established thermal management applications. Several factors …
Review of heat transfer enhancement techniques in two-phase flows for highly efficient and sustainable cooling
Two-phase internal flow is ubiquitous to many systems due to its ability to transfer large
amounts of heat effectively. Recent advances motivated by sustainability have pushed …
amounts of heat effectively. Recent advances motivated by sustainability have pushed …
Experimental study on thermal performance of ultra-thin heat pipe with a novel composite wick structure
F Yi, Y Gan, Z **n, Y Li, H Chen - International Journal of Thermal Sciences, 2023 - Elsevier
The rapid advancement of high-performance electronic devices and high-capacity energy
storage has prompted the development of ultra-thin heat pipes with a higher heat transfer …
storage has prompted the development of ultra-thin heat pipes with a higher heat transfer …
A novel ultra-thin flattened heat pipe with biporous spiral woven mesh wick for cooling electronic devices
W Zhou, Y Li, Z Chen, L Deng, Y Gan - Energy Conversion and …, 2019 - Elsevier
In this work, a novel biporous spiral woven mesh wick is developed to enhance the thermal
performance of an ultra-thin flattened heat pipe for cooling high heat flux electronic devices …
performance of an ultra-thin flattened heat pipe for cooling high heat flux electronic devices …
Design, fabrication and thermal performance of a novel ultra-thin vapour chamber for cooling electronic devices
Z Chen, Y Li, W Zhou, L Deng, Y Yan - Energy conversion and …, 2019 - Elsevier
In this work, a novel vapour-liquid channel-separated ultra-thin (0.4-mm-thick) vapour
chamber fabricated via etching and diffusion bonding was designed for cooling electronic …
chamber fabricated via etching and diffusion bonding was designed for cooling electronic …
Thermal performance of an ultra-thin flat heat pipe with striped super-hydrophilic wick structure
Z Cui, L Jia, Z Wang, C Dang, L Yin - Applied Thermal Engineering, 2022 - Elsevier
The development of high-performance electronic devices requires high heat transfer
components with small thickness and high thermal performance. This paper presented an …
components with small thickness and high thermal performance. This paper presented an …
A new ultra-thin vapor chamber with composite wick for thin electronic products
G Huang, W Liu, Y Luo, Y Li, H Chen - International Journal of Thermal …, 2021 - Elsevier
The ever-increasing performance of thin portable electronic products has made their heat
dissipation issues more and more severe, or even become failure. A novel 0.5 mm thick ultra …
dissipation issues more and more severe, or even become failure. A novel 0.5 mm thick ultra …
Mechanism of a microscale flat plate heat pipe with extremely high nominal thermal conductivity for cooling high-end smartphone chips
J Li, L Lv, G Zhou, X Li - Energy conversion and management, 2019 - Elsevier
For flat plate heat pipes, under the premise of holding high thermal spreading performance
meanwhile being as thin as possible for cooling smartphones, the flow resistance should be …
meanwhile being as thin as possible for cooling smartphones, the flow resistance should be …