The current paper reviews the research conducted on wrought Cu–Sn, Cu–Sn–Ti and Cu–
Sn–Zn alloys intending to reveal the details on morphological and mechanical behaviour …

In this investigation, ultrasonic-assisted soldering at 260° C in air produced high strength
and high melting point Cu connections in 60 s using Ni foam reinforced Sn composite …

We investigate the role of an Ag interlayer to suppress Kirkendall void formation in Ti/Ni
surface finishes on the die-attached joints during harsh thermal aging tests at 250° C. GaN …

The V-Zn phase diagram became available after 1990. The existence of the VZn 16 phase
has been questioned mainly. A solid–state diffusion experiment is conducted to …

Dense and homogeneous W–Cu composites with high strength were successfully prepared
from Cu-coated W powders by hot pressure sintering (800° C) with Sn as activated additives …

Silicon is a high-capacity and safer next-generation anode material for Li-ion batteries, with
challenges from rapid capacity fade due to colossal volume changes during Li alloying/de …

The growth behaviors of intermetallic compounds (IMCs) in Cu pillar solder bumps during
high temperature aging were studied by microstructural observations and mathematical …

Electroless Ni-P plating has good prospects for application as a diffusion barrier layer for
interfacial reactions. In this study, the interfacial reaction between the microcone-structured …

The high-melting-point joints by transient-liquid-phase are increasingly playing a crucial role
in the die bonding for the high temperature electronic components. In this study, three kinds …

In 3D IC, a high-efficiency diffusion barrier layer is urgently required for Sn/Cu micro-bumps,
to inhibit the formation of Cu–Sn intermetallic compounds (IMCs). In this work, the barrier …