MEMS for wireless communications:'from RF-MEMS components to RF-MEMS-SiP'
Wireless communication has led to an explosive growth of emerging consumer and military
applications of radio frequency (RF), microwave and millimeter wave circuits and systems …
applications of radio frequency (RF), microwave and millimeter wave circuits and systems …
An analysis of the fundamental constraints on low cost passive radio-frequency identification system design
TA Scharfeld - 2001 - dspace.mit.edu
Passive radio frequency identification (RFID) systems provide an automatic means to
inexpensively, accurately, and flexibly capture information. In combination with the Internet …
inexpensively, accurately, and flexibly capture information. In combination with the Internet …
Accurate modeling of high-Q spiral inductors in thin-film multilayer technology for wireless telecommunication applications
P Pieters, K Vaesen, S Brebels… - IEEE Transactions …, 2001 - ieeexplore.ieee.org
In the current trend toward portable applications, high-Q integrated inductors are gaining a
lot of importance. Using thin-film multilayer or multichip-module-deposition technology, high …
lot of importance. Using thin-film multilayer or multichip-module-deposition technology, high …
Integrated circuit ceramic ball grid array package antenna
YP Zhang - IEEE Transactions on Antennas and Propagation, 2004 - ieeexplore.ieee.org
The recent advances in such highly integrated RF transceivers as radio system-on-chip and
radio system-in-package have called for the parallel development of compact and efficient …
radio system-in-package have called for the parallel development of compact and efficient …
Integrated RF architectures in fully-organic SOP technology
MF Davis, A Sutono, SW Yoon… - IEEE Transactions …, 2002 - ieeexplore.ieee.org
Future wireless communications systems require better performance, lower cost, and
compact RF front-end footprint. The RF front-end module development and its level of …
compact RF front-end footprint. The RF front-end module development and its level of …
Single-package integration of RF blocks for a 5 GHz WLAN application
W Diels, K Vaesen, P Wambacq… - IEEE Transactions …, 2001 - ieeexplore.ieee.org
Transceivers for future digital telecommunications applications (third generation cellular,
wireless LAN) need to be portable (compact), battery-powered and wireless. Today's single …
wireless LAN) need to be portable (compact), battery-powered and wireless. Today's single …
Design of integrated low noise amplifiers (LNA) using embedded passives in organic substrates
V Govind, S Dalmia… - IEEE Transactions on …, 2004 - ieeexplore.ieee.org
The noise figure of a low noise amplifier (LNA) is a function of the quality factor of its
inductors. The lack of high-Q inductors in silicon has prevented the development of …
inductors. The lack of high-Q inductors in silicon has prevented the development of …
[BOOK][B] High performance barium strontium titanate varactor technology for microwave circuit applications
B Acikel - 2002 - search.proquest.com
Abstract A monolithic Barium Strontium Titanate (BST) thin film varactor technology has
been developed for low-cost circuit applications. BST thin films have several properties that …
been developed for low-cost circuit applications. BST thin films have several properties that …
Cost and performance tradeoff analysis in radio and mixed-signal system-on-package design
LR Zheng, X Duo, M Shen… - IEEE Transactions …, 2004 - ieeexplore.ieee.org
An optimal total solution for radio and mixed-signal system integration needs tradeoffs
between different design options. Among various design metrics, cost and performance are …
between different design options. Among various design metrics, cost and performance are …
Integration of microstrip antenna on cavity-down ceramic ball grid array package
YP Zhang - Electronics Letters, 2002 - search.proquest.com
The integration of a microstrip antenna on a thin 17× 17× 2mm cavity-down ceramic ball grid
array package is reported. The antenna, intended for use in either single-chip or single …
array package is reported. The antenna, intended for use in either single-chip or single …