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Method of manufacture for a silicon-on-plastic semiconductor device with interfacial adhesion layer
JC Costa - US Patent 9,812,350, 2017 - Google Patents
(57) ABSTRACT A semiconductor device and methods for manufacturing the same are
disclosed. The semiconductor device includes a polymer substrate and an interfacial layer …
disclosed. The semiconductor device includes a polymer substrate and an interfacial layer …
Flip chip module with enhanced properties
JC Costa, TS Morris, JH Hammond… - US Patent …, 2018 - Google Patents
A flip chip module having at least one flip chip die is disclosed. The flip chip module includes
a carrier having a top surface with a first mold compound residing on the top surface. A first …
a carrier having a top surface with a first mold compound residing on the top surface. A first …
Method for manufacturing an integrated circuit package
This disclosure relates to integrated circuit (IC) packages and methods of manufacturing the
same. In one method, a printed circuit board is provided with semiconductor die. The …
same. In one method, a printed circuit board is provided with semiconductor die. The …
Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same
(57) ABSTRACT A printed circuit module and methods for manufacturing the same are
disclosed. The printed circuit module includes a printed circuit substrate with a thinned die …
disclosed. The printed circuit module includes a printed circuit substrate with a thinned die …
Wafer-level package with enhanced performance
MA Hatcher, JH Hammond, J Chadwick… - US Patent …, 2019 - Google Patents
The present disclosure relates to a wafer-level package that includes a first thinned die, a
multilayer redistribution struc ture, a first mold compound, and a second mold compound …
multilayer redistribution struc ture, a first mold compound, and a second mold compound …
Silicon-on-plastic semiconductor device with interfacial adhesion layer
JC Costa - US Patent 10,134,627, 2018 - Google Patents
(57) ABSTRACT A semiconductor device and methods for manufacturing the same are
disclosed. The semiconductor device includes a polymer substrate and an interfacial layer …
disclosed. The semiconductor device includes a polymer substrate and an interfacial layer …
Microelectronics package with inductive element and magnetically enhanced mold compound component
The present disclosure relates to a microelectronics package with an inductive element and
a magnetically enhanced mold compound component, and a process for making the same …
a magnetically enhanced mold compound component, and a process for making the same …
Method of manufacture for a semiconductor device
US10062637B2 - Method of manufacture for a semiconductor device - Google Patents
US10062637B2 - Method of manufacture for a semiconductor device - Google Patents Method of …
US10062637B2 - Method of manufacture for a semiconductor device - Google Patents Method of …
Wafer-level package with enhanced performance
JC Costa, J Chadwick, D Jandzinski… - US Patent …, 2020 - Google Patents
The present disclosure relates to a wafer-level package that includes a first thinned die
having a first device layer, a multilayer redistribution structure, a first mold compound, and a …
having a first device layer, a multilayer redistribution structure, a first mold compound, and a …
Thermally enhanced semiconductor package with thermal additive and process for making the same
The present disclosure relates to a thermally enhanced semiconductor package, which
includes a module substrate, a thinned flip chip die over the substrate, a first mold …
includes a module substrate, a thinned flip chip die over the substrate, a first mold …