Frequency multiplexer

C Zuo, DD Kim, DF Berdy, CH Yun, JHJ Lan… - US Patent …, 2018 - Google Patents
An apparatus is disclosed that includes a frequency multiplexer circuit coupled to an input
node and configured to receive an input signal via the input node. The frequency multiplexer …

2D and 3D inductors antenna and transformers fabricating photoactive substrates

JH Flemming, J Bullington, R Cook… - US Patent …, 2020 - Google Patents
(57) ABSTRACT A method of fabrication and device made by preparing a photosensitive
glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide …

Hybrid transformer structure on semiconductor devices

CS Lo, JH Lan, MF Velez, J Kim - US Patent 9,431,473, 2016 - Google Patents
04 tioned on a second layer of the die. The second layer is positioned above the substrate.
The second set of windings includes a third port, a fourth port and a fifth port. The second set …

Vertical-coupling transformer with an air-gap structure

JH Lan, CS Lo, J Kim, JH Hong - US Patent 10,002,700, 2018 - Google Patents
In a particular embodiment, a device includes a low-loss substrate, a first inductor structure,
and an air-gap. The first inductor structure is between the low-loss substrate and a second …

Integration of a replica circuit and a transformer above a dielectric substrate

JH Lan, CS Lo, J Kim, MF Velez, JH Hong - US Patent 9,634,645, 2017 - Google Patents
(57) ABSTRACT A particular device includes a replica circuit disposed above a dielectric
substrate. The replica circuit includes a thin film transistor (TFT) configured to function as a …

2D and 3D RF lumped element devices for RF system in a package photoactive glass substrates

JH Flemming, JA Bullington, K McWethy - US Patent 11,342,896, 2022 - Google Patents
The present invention includes a method for creating a system in a package with integrated
lumped element devices is system-in-package (SiP) or in photo-definable glass, com …

Coil component and method of manufacturing same

KW Bong, BS Kim, JH Kim, JS Yoon… - US Patent 10,515,754, 2019 - Google Patents
(57) ABSTRACT A coil component includes an insulating layer having a coil shape, first and
second coil conductor layers on opposing surfaces of the insulating layer, each having a coil …

Inductors for chip to chip near field communication

E Chong, D Tonietto, Z **ang - US Patent 10,483,343, 2019 - Google Patents
Example vertical inductors described herein may be applicable to integrated inductors that
are conventionally implemented in the horizontal plane of the integrated circuit. Example …

Parallel stacked inductor for high-Q and high current handling and method of making the same

VNR Vanukuru - US Patent 10,553,353, 2020 - Google Patents
(57) ABSTRACT A high performance, on-chip a parallel stacked inductor which achieves a
higher Q value. The inductor is formed on a layered substrate with a top metal layer having …

Dynamic magnetic stripe communications device with beveled magnetic material for magnetic cards and devices

JH Workley - US Patent 10,922,597, 2021 - Google Patents
(57) ABSTRACT A flexible card may include a dynamic magnetic stripe communications
device having multiple layers, such as an electromagnetic generator, a magnet, and a …