Influence of annealing atmosphere on the electrical conductivity of copper nanoparticle films

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Rapid and low temperature sintering bonding using Cu nanoparticle film for power electronic packaging

Y Wu, G Zou, S Wang, W Guo, H Zhang, P Peng… - Applied Surface …, 2022 - Elsevier
It is of great interest but very difficult to achieve both rapid (few minutes) and low temperature
(< 200° C) sintering bonding using Cu nanoparticles, which is mainly due to the diffusion …
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Sintering of Cu particles baked by formic acid vapor for Cu–Cu low temperature bonding

S Liu, L Yang, J **n, X Lv, Y Chen, Y Liu - Journal of Materials Science …, 2024 - Springer
Cu particles sintering is considered one of the most suitable connection technologies for
power devices, but Cu has poor oxidation resistance and Cu oxides hinder the sintering …
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Die attachment by extremely fast pressure-assisted sintering of 200 nm Cu particles

MI Kim, JH Lee - Electronic Materials Letters, 2021 - Springer
To achieve a sinter bonding process of powder devices for the formation of a bondline with
high-temperature mechanical sustainability and superior thermal conductance, the bonding …
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Effect of Heat Treatment on Microstructure and Hardness of Cu–Mg Alloy with a Trace of Ca

SH Ha, YO Yoon, HK Lim… - Journal of Nanoscience …, 2017 - ingentaconnect.com
Changes of microstructure and hardness of Cu-2 mass% Mg alloy with varying heat
treatment conditions were investigated. Oxidation resistant Mg+ Mg2Ca master alloy was …
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[書籍][B] Pulsed Electric Field (PEF) Applications in Tap Water Disinfection and Electrochemical Nitrate Reduction

TRN Dy - 2021 - search.proquest.com
The prevalence of antibiotic-resistant bacteria and their resistance genes in
chemicallydisinfected municipal waters reveals the need for supplementary water …
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3D Printing Based Single-Build Process for Electronic Devices

HW Dang, YS Kim, YJ Yang, BJ Koo… - … of Nanoscience and …, 2017 - ingentaconnect.com
Electronic components that are fabricated by 3D printing are still struggling in performance
compared to those fabricated using conventional materials and methods. In this study, we …
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