GaN-based power devices: Physics, reliability, and perspectives

M Meneghini, C De Santi, I Abid, M Buffolo… - Journal of Applied …, 2021‏ - pubs.aip.org
Over the last decade, gallium nitride (GaN) has emerged as an excellent material for the
fabrication of power devices. Among the semiconductors for which power devices are …

“Hole Redistribution” Model Explaining the Thermally Activated RON Stress/Recovery Transients in Carbon-Doped AlGaN/GaN Power MIS-HEMTs

N Zagni, A Chini, FM Puglisi… - … on Electron Devices, 2021‏ - ieeexplore.ieee.org
R ON degradation due to stress in GaN-based power devices is a critical issue that limits,
among other effects, long-term stable operation. Here, by means of 2-D device simulations …

Partial Recovery of Dynamic RON Versus OFF-State Stress Voltage in p-GaN Gate AlGaN/GaN Power HEMTs

M Cioni, N Zagni, F Iucolano… - … on Electron Devices, 2021‏ - ieeexplore.ieee.org
Dynamic dispersion due to buffer traps is a well-known issue of GaN power high electron
mobility transistors (HEMTs), critically impacting their performance and stability. Several …

The Transition of Threshold Voltage Shift of Al2O3/Si3N4 AlGaN/GaN MIS-HEMTs Under Negative Gate Bias Stress From DC to AC

YH Lee, KC Chang, MC Tai, YX Wang… - … on Electron Devices, 2024‏ - ieeexplore.ieee.org
In this study, the reliability issues are discussed under dc and ac negative gate bias stress
(ac-NGBS) in Al2O3/Si3N4 metal–insulator–semiconductor high electron mobility transistors …

[HTML][HTML] On the modeling of the donor/acceptor compensation ratio in carbon-doped GaN to univocally reproduce breakdown voltage and current collapse in lateral …

N Zagni, A Chini, FM Puglisi, P Pavan, G Verzellesi - Micromachines, 2021‏ - mdpi.com
The intentional do** of lateral GaN power high electron mobility transistors (HEMTs) with
carbon (C) impurities is a common technique to reduce buffer conductivity and increase …

Mechanisms Underlying the Bidirectional VT Shift After Negative-Bias Temperature Instability Stress in Carbon-Doped Fully Recessed AlGaN/GaN MIS-HEMTs

N Zagni, M Cioni, A Chini, F Iucolano… - … on Electron Devices, 2021‏ - ieeexplore.ieee.org
In this brief, we investigate the bidirectional threshold voltage drift (ΔV T) following negative-
bias temperature instability (NBTI) stress in carbon-doped fully recessed AlGaN/GaN metal …

Experimental and numerical investigation of Poole–Frenkel effect on dynamic R ON transients in C-doped p-GaN HEMTs

N Zagni, M Cioni, F Iucolano, M Moschetti… - Semiconductor …, 2021‏ - iopscience.iop.org
In this paper, we investigate the influence of Poole–Frenkel effect (PFE) on the dynamic R
ON transients in C-doped p-GaN HEMTs. To this aim, we perform a characterization of the …

Temperature-Independent Current Dispersion in 0.15 μm AlGaN/GaN HEMTs for 5G Applications

N Zagni, G Verzellesi, A Chini - Micromachines, 2022‏ - mdpi.com
Thanks to high-current densities and cutoff frequencies, short-channel length AlGaN/GaN
HEMTs are a promising technology solution for implementing RF power amplifiers in 5G …

Influence of carbon on pBTI degradation in GaN-on-Si E-mode MOSc-HEMT

AG Viey, W Vandendaele, MA Jaud… - … on Electron Devices, 2021‏ - ieeexplore.ieee.org
In this article, threshold-voltage V TH instabilities under positive gate voltage stress V
GStress in GaN-on-Si devices are thoroughly investigated. Measurement-stress …

Study on the difference between ID (VG) and C (VG) pBTI shifts in GaN-on-Si E-mode MOSc-HEMT

AG Viey, W Vandendaele, MA Jaud… - 2021 IEEE …, 2021‏ - ieeexplore.ieee.org
In this study, we investigate the difference between ID (VG) and C (VG) pBTI shifts on GaN-
on-Si E-mode MOS-channel HEMTs, under various gate voltage stresses (V GStress) and …