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Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions
Nanocomposite lead-free solders are gaining prominence as replacements for conventional
lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are …
lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are …
Effects of metallic nanoparticles on interfacial intermetallic compounds in tin-based solders for microelectronic packaging
Tin (Sn)-based solders have established themselves as the main alternative to the
traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn …
traditional lead (Pb)-based solders in many applications. However, the reliability of the Sn …
Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling
L Yang, L Zhu, Y Zhang, S Zhou, G Wang… - Materials …, 2019 - Elsevier
The microstructure, IMCs layer and reliability of Sn-58Bi and Sn-58Bi-0.25 Mo solder joints
during thermal cycling were investigated. The results showed that the microstructure of Sn …
during thermal cycling were investigated. The results showed that the microstructure of Sn …
Stability of molybdenum nanoparticles in Sn–3.8 Ag–0.7 Cu solder during multiple reflow and their influence on interfacial intermetallic compounds
This work investigates the effects of molybdenum nanoparticles on the growth of interfacial
intermetallic compound between Sn–3.8 Ag–0.7 Cu solder and copper substrate during …
intermetallic compound between Sn–3.8 Ag–0.7 Cu solder and copper substrate during …
Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux do**
The characteristics of interfacial intermetallic compounds (IMCs) can have serious impact on
the reliability of solder joints. In this study, Ni nanoparticles (NPs) were added to SAC305 …
the reliability of solder joints. In this study, Ni nanoparticles (NPs) were added to SAC305 …
Investigation of the interfacial reactions between Sn-3.0 wt% Ag-0.5 wt% Cu solder and CuTi alloy (C1990HP)
YW Yen, AD Laksono, CY Yang - Microelectronics Reliability, 2019 - Elsevier
The interfacial reactions between Sn-3.0 wt% Ag-0.5 wt% Cu (SAC) solder and Cusingle
bondTi alloy (C1990HP) using the solid/liquid reaction couple technique reflowed at 240 …
bondTi alloy (C1990HP) using the solid/liquid reaction couple technique reflowed at 240 …
Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn‐3.8 Ag‐0.7 Cu solder and copper substrate
Purpose–The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on
the interfacial intermetallic compounds (IMCs) between Sn‐3.8 Ag‐0.7 Cu (SAC) solder and …
the interfacial intermetallic compounds (IMCs) between Sn‐3.8 Ag‐0.7 Cu (SAC) solder and …
The mechanical and microstructural changes of Sn-Ag-Bi solders with cooling rate and Bi content variations
The purpose of this study is to investigate the influence of cooling rate and Bi addition on the
microstructure evolution and mechanical properties of Sn-3.5 Ag alloy. A series of Sn-3.5 Ag …
microstructure evolution and mechanical properties of Sn-3.5 Ag alloy. A series of Sn-3.5 Ag …
Microstructure and reliability of Mo nanoparticle reinforced Sn–58Bi-based lead-free solder joints
L Yang, L Zhu, Y Zhang, P Liu… - Materials Science …, 2018 - journals.sagepub.com
The effect of Mo nanoparticles on the microstructure, wettability and mechanical properties
of Sn–58Bi–x Mo (x= 0–2.00) solder joints was investigated. The results showed that the …
of Sn–58Bi–x Mo (x= 0–2.00) solder joints was investigated. The results showed that the …
Effects of Mo nanoparticles addition on the evolution of microstructure in Cu58Bi-xMo/Cu solder joints during aging
L Yang, X Lu, G Mu - Materials Today Communications, 2022 - Elsevier
A novel composite lead-free solder was prepared by adding Mo nanoparticles in Sn58Bi
solder. Microstructure evolution of Sn58Bi-xMo (x= 0, 0.5%, 1%)/Cu solder joints were …
solder. Microstructure evolution of Sn58Bi-xMo (x= 0, 0.5%, 1%)/Cu solder joints were …