In this work, combing the Gaussian filtering algorithm and the cutting quantile functions, a
new technique is developed to efficiently generate the RVE of randomly distributed metal …

The stress–strain response of sintered silver nanoparticles (AgNP) materials is precisely
characterized in order to adapt for numerical analysis and rational design of electronic …

Due to the miniaturization development in the electronic packaging industry and the
significant thermal management requirement for high-power electronic devices, the sintered …

Metallized arrays of three-dimensional (3D) nanoarchitectures offer new and exciting
prospects in nanophotonics and nanoelectronics. Engineering these repeating …

As one of the promising packaging materials, the paste of silver nanoparticles (AgNPs)
reinforced by SiC particles is investigated in this study for microstructure, thermal stability …

This work firstly evaluated the microscale mechanical properties of sintered Ag, consisting of
various Ag particles of a flake shape and spherical shape from nano to micro size …

Sintered silver is a very promising option in the field of automotive power electronics for die-
attach and substrate-attach material as it offers many benefits compared to conventional …

Sintered Cu interconnection for power electronics has attracted considerable interest
recently. Investigation of grain growth during Cu nanoparticle sintering provides insight into …

Ag sinter joining technology has been used in the advanced power applications to replace
conventional soldering technology due to its high temperature stability, along with its …

This study focuses on the realization of rapid Ag sintering in 10 minutes under various
temperature conditions without pressure in the air. In each temperature range from 175° C to …