The continuous improvement of electronic device performances and the advancement of
packaging technology have brought greater challenges to the reliability of solder joints in …

Electronic products are evolving towards miniaturization, high integration, and multi-function,
which undoubtedly puts forward higher requirements for the reliability of solder joints in …

Abstract The Package-on-Package (PoP) technology is an efficient knowhow to increase the
efficiency of electronic components, hence to secure the continuation of the validity of …

The development of big data and artificial intelligence technology is increasing the need for
electronic devices to become smaller, cheaper, and more energy efficient, while also having …

Abstract In this work, Cu/Sn/Cu solder joints were fabricated by low temperature transient
liquid phase (TLP) bonding. The microstructure evolution and grain orientation of …

Solid-liquid interdiffusion (SLID) bonding was extensively investigated as a potential
bonding method applied to 3D chip stacking because it can be bonded at a low temperature …

Abstract In total, 0.5 wt% CuZnAl memory particles with the diameters (2–6 μm) were added
into Sn–58Bi solder in order to enhance the properties of solder joints in electronic …

Semiconductor packaging materials play a critical role in the development of semiconductor
devices. They not only provide reliable protection and support, but also contribute to the …

Abstract The copper-copper (Cu-Cu) direct bonding technology was proposed in recent
years in order to realize precise preparation and reliable service under high current density …

Argon (Ar) plasma surface modification and highly (1 1 1)-oriented nanotwinned copper (nt-
Cu) were combined to lower the bonding temperature of Cu/SiO 2 hybrid joints. The contact …