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Design for manufacturability and reliability in extreme-scaling VLSI
In the last five decades, the number of transistors on a chip has increased exponentially in
accordance with the Moore's law, and the semiconductor industry has followed this law as …
accordance with the Moore's law, and the semiconductor industry has followed this law as …
ABCDPlace: Accelerated batch-based concurrent detailed placement on multithreaded CPUs and GPUs
Placement is an important step in modern verylarge-scale integrated (VLSI) designs.
Detailed placement is a placement refining procedure intensively called throughout the …
Detailed placement is a placement refining procedure intensively called throughout the …
MrDP: Multiple-row detailed placement of heterogeneous-sized cells for advanced nodes
As very large-scale integration technology shrinks to fewer tracks per standard cell, eg, from
10 to 7.5-track libraries (and lesser for 7 nm), there has been a rapid increase in the usage …
10 to 7.5-track libraries (and lesser for 7 nm), there has been a rapid increase in the usage …
Device layer-aware analytical placement for analog circuits
The layouts of analog/mixed-signal (AMS) integrated circuits (ICs) are dramatically different
from their digital counterparts. AMS circuit layouts usually include a variety of devices …
from their digital counterparts. AMS circuit layouts usually include a variety of devices …
[ΒΙΒΛΙΟ][B] Timing performance of nanometer digital circuits under process variations
V Champac, JG Gervacio - 2018 - Springer
Integrated circuits are present in a diversity of electronic applications around us. We can find
them in a wide spectrum of consumer applications like smartphones, iPods, video games …
them in a wide spectrum of consumer applications like smartphones, iPods, video games …
Enhanced optimal multi-row detailed placement for neighbor diffusion effect mitigation in sub-10 nm VLSI
Layout-dependent effect causes variation in device performance as well as mismatch in
model-hardware correlation in sub-10 nm nodes. In order to effectively explore the power …
model-hardware correlation in sub-10 nm nodes. In order to effectively explore the power …
Stitch aware detailed placement for multiple e-beam lithography
In multiple electron beam lithography (MEBL), a layout is split into stripes and the layout
patterns are cut by stripe boundaries, then all the stripes are printed in parallel. If a via …
patterns are cut by stripe boundaries, then all the stripes are printed in parallel. If a via …
Optimal multi-row detailed placement for yield and model-hardware correlation improvements in sub-10nm VLSI
In sub-10nm, nodes, a change or step in diffusion height between adjacent standard cells
causes yield loss as well as a form of model-hardware miscorrelation called neighbor …
causes yield loss as well as a form of model-hardware miscorrelation called neighbor …
Modeling and detectability of full open gate defects in finfet technology
F Forero, H Villacorta, M Renovell… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
FinFET technology is an attractive candidate for high-performance and power-efficient
application and is currently used for several electronic products. FinFET technology …
application and is currently used for several electronic products. FinFET technology …
Vertical M1 routing-aware detailed placement for congestion and wirelength reduction in sub-10nm nodes
Aggressive pitch scaling in sub-10nm nodes has introduced complex design rules which
make routing extremely challenging. Cell architectures have also been changed to meet the …
make routing extremely challenging. Cell architectures have also been changed to meet the …