LED technology is a multidisciplinary subject that involves semiconductor physics,
photometry, electric power, heat, and chromaticity. It has been demonstrated that operating …

This article introduces an online condition monitoring strategy that utilizes a transient heat
pulse to detect package thermal performance degradation. The metric employed is the …

In this paper, we propose to monitor the thermal parameters of insulated gate bipolar
transistor (IGBT) module using the case temperature. This method works during the shutoff …

In this work, an evaluation method for transient thermal measurements is presented. It allows
for a high temporal sensitivity by analysing the spectral composition of a thermal transient …

摘要绝缘栅双极型晶体管(IGBT) 是电力电子系统实现电能变换与控制的核心组件之一. 然而,
工业界反馈的数据表明, 应用于高可靠性场合的IGBT 模块可靠性并不高, 其热疲劳失效将会导致 …

Thermal transient measurement based on structure function evaluation was used to
measure the thermal resistance. The study signifies the importance of dual interface method …

This paper investigates a novel packaging that can effectively improve the efficiency and
reliability of 280-nm deep ultraviolet (DUV) light-emitting diodes (LEDs). The experimental …

An accurate and efficient algorithm is presented, which allows deriving the structure function
of a discretized 3-D heat conduction problem. In this approach, the partial thermal …

In this chapter, after a generic discussion of thermal testing techniques used to characterize
packaged semiconductor devices; the latest practical test methods widespread in thermal …

The purpose of this study is to investigate the thermal behavior at the die-attached interfaces
of flip-chip GaN high-power light emitting diodes (LEDs) using a combination of theoretical …