Recent thermal management techniques for microprocessors

J Kong, SW Chung, K Skadron - ACM Computing Surveys (CSUR), 2012 - dl.acm.org
Microprocessor design has recently encountered many constraints such as power, energy,
reliability, and temperature. Among these challenging issues, temperature-related issues …

A survey on energy management for mobile and IoT devices

S Pasricha, R Ayoub, M Kishinevsky… - IEEE Design & …, 2020 - ieeexplore.ieee.org
Mobile and IoT devices have proliferated our daily lives. However, these miniaturized
computing systems should be highly energy-efficient due to their ultrasmall form factor …

Thermal covert channels on multi-core platforms

RJ Masti, D Rai, A Ranganathan, C Müller… - 24th USENIX security …, 2015 - usenix.org
Side channels remain a challenge to information flow control and security in modern
computing platforms. Resource partitioning techniques that minimise the number of shared …

Machine learning-based temperature prediction for runtime thermal management across system components

K Zhang, A Guliani, S Ogrenci-Memik… - … on parallel and …, 2017 - ieeexplore.ieee.org
Elevated temperatures limit the peak performance of systems because of frequent
interventions by thermal throttling. Non-uniform thermal states across system nodes also …

Markerless motion capture with unsynchronized moving cameras

N Hasler, B Rosenhahn, T Thormahlen… - … IEEE Conference on …, 2009 - ieeexplore.ieee.org
In this work we present an approach for markerless motion capture (MoCap) of articulated
objects, which are recorded with multiple unsynchronized moving cameras. Instead of using …

Survey of energy-cognizant scheduling techniques

S Zhuravlev, JC Saez, S Blagodurov… - … on Parallel and …, 2012 - ieeexplore.ieee.org
Execution time is no longer the only metric by which computational systems are judged. In
fact, explicitly sacrificing raw performance in exchange for energy savings is becoming a …

Underdesigned and opportunistic computing in presence of hardware variability

P Gupta, Y Agarwal, L Dolecek, N Dutt… - … on Computer-Aided …, 2012 - ieeexplore.ieee.org
Microelectronic circuits exhibit increasing variations in performance, power consumption,
and reliability parameters across the manufactured parts and across use of these parts over …

Predictive dynamic thermal and power management for heterogeneous mobile platforms

G Singla, G Kaur, AK Unver… - 2015 Design, Automation …, 2015 - ieeexplore.ieee.org
Heterogeneous multiprocessor systems-on-chip (MPSoCs) powering mobile platforms
integrate multiple asymmetric CPU cores, a GPU, and many specialized processors. When …

Dynamic thermal management through task scheduling

J Yang, X Zhou, M Chrobak, Y Zhang… - ISPASS 2008-IEEE …, 2008 - ieeexplore.ieee.org
The evolution of microprocessors has been hindered by their increasing power consumption
and the heat generation speed on-die. High temperature impairs the processor's reliability …

Cooling capacity figure of merit for phase change materials

PJ Shamberger - Journal of Heat Transfer, 2016 - asmedigitalcollection.asme.org
In this paper, a figure of merit for the cooling capacity (FOMq) of phase change materials
(PCMs) is defined from the analytical solution of the two-phase Neumann–Stefan problem of …