[HTML][HTML] A review of the state-of-the-art in electronic cooling
The cooling or thermal management issues are facing critical challenges with the
continuous miniaturization and rapid increase of heat flux of electronic devices. Significant …
continuous miniaturization and rapid increase of heat flux of electronic devices. Significant …
Advancements and challenges in ultra-thin vapor chambers for high-efficiency electronic thermal management: A comprehensive review
F Zhou, J Zhou, X Huai - International Journal of Heat and Mass Transfer, 2023 - Elsevier
Portable electronic products are continuously evolving towards compactness, integration,
and high performance, resulting in electronic chips generating significant heat in a confined …
and high performance, resulting in electronic chips generating significant heat in a confined …
A novel ultra-thin vapor chamber with composite wick for portable electronics cooling
C Yan, H Li, Y Tang, X Ding, X Yuan, Y Liang… - Applied Thermal …, 2023 - Elsevier
With the development of integrated and ultra-thin portable electronics, the ultimate heat
dissipation power in extremely narrow spaces (< 1 mm) is increasing year by year. However …
dissipation power in extremely narrow spaces (< 1 mm) is increasing year by year. However …
Research progress on efficient thermal management system for electric vehicle batteries based on two-phase transformation
R Li, Y Gan, Q Luo, Y Yan, Y Li - Applied Thermal Engineering, 2023 - Elsevier
Given the energy situation and the rapid growth of the electric vehicle market, electric
vehicles (EVs) will face high battery heat production and performance issues brought about …
vehicles (EVs) will face high battery heat production and performance issues brought about …
[HTML][HTML] A review of heat pipe technology for foldable electronic devices
The advent of foldable and wearable devices, such as the Samsung Galaxy Fold (2019) and
Huawei Mate X (2019), require increased battery size and processor performance to drive …
Huawei Mate X (2019), require increased battery size and processor performance to drive …
A novel ultra-thin vapor chamber for heat dissipation in ultra-thin portable electronic devices
G Huang, W Liu, Y Luo, Y Li - Applied Thermal Engineering, 2020 - Elsevier
Ultra-thin vapor chamber (UTVC) is an efficient heat transfer element that meets the heat
dissipation requirement of miniaturized electronics. In this study, a novel UTVC (0.5 mm …
dissipation requirement of miniaturized electronics. In this study, a novel UTVC (0.5 mm …
Experimental investigation on working fluid selection in a micro pulsating heat pipe
J Kim, SJ Kim - Energy Conversion and Management, 2020 - Elsevier
A guideline for the working fluid selection in a micro pulsating heat pipe (MPHP) is
experimentally developed. A closed-loop ten-turn MPHP with overall dimensions of 80× 35× …
experimentally developed. A closed-loop ten-turn MPHP with overall dimensions of 80× 35× …
Significant factors affecting heat transfer performance of vapor chamber and strategies to promote it: A critical review
D **e, Y Sun, G Wang, S Chen, G Ding - … Journal of Heat and Mass Transfer, 2021 - Elsevier
The increasing heat flux of electronic systems, caused by the miniaturization and high
integration, has posed a huge challenge to efficient and effective thermal management …
integration, has posed a huge challenge to efficient and effective thermal management …
Thermal performance of an ultra-thin flat heat pipe with striped super-hydrophilic wick structure
Z Cui, L Jia, Z Wang, C Dang, L Yin - Applied Thermal Engineering, 2022 - Elsevier
The development of high-performance electronic devices requires high heat transfer
components with small thickness and high thermal performance. This paper presented an …
components with small thickness and high thermal performance. This paper presented an …
A new ultra-thin vapor chamber with composite wick for thin electronic products
G Huang, W Liu, Y Luo, Y Li, H Chen - International Journal of Thermal …, 2021 - Elsevier
The ever-increasing performance of thin portable electronic products has made their heat
dissipation issues more and more severe, or even become failure. A novel 0.5 mm thick ultra …
dissipation issues more and more severe, or even become failure. A novel 0.5 mm thick ultra …