Thin flip—chip method
FB Grigg, TL Jackson - US Patent 6,506,681, 2003 - Google Patents
The present invention relates to a method of thinning Semiconductor wafers. More
Specifically, the present inven tion relates to a method of Supporting bumped Semiconduc …
Specifically, the present inven tion relates to a method of Supporting bumped Semiconduc …
Electronic modules and methods for forming the same
LM Racz, GB Tepolt, JC Thompson, TA Langdo… - US Patent …, 2011 - Google Patents
US8017451B2 - Electronic modules and methods for forming the same - Google Patents
US8017451B2 - Electronic modules and methods for forming the same - Google Patents …
US8017451B2 - Electronic modules and methods for forming the same - Google Patents …
Wafer reinforcement structure and methods of fabrication
KK Kirby - US Patent 7,244,663, 2007 - Google Patents
A method of fabricating a thinned, reinforced semiconductor wafer is disclosed. Particularly,
a semiconductor wafer may be provided and a plurality of separate semiconductor dice may …
a semiconductor wafer may be provided and a plurality of separate semiconductor dice may …
Light emitting diode and method of making the same
KN Yang, TP Chen, CS Chang - US Patent 6,682,950, 2004 - Google Patents
A light emitting diode (LED) and method of making the same are disclosed. The present
invention uses a layer of transparent adhesive material to bond a transparent substrate and …
invention uses a layer of transparent adhesive material to bond a transparent substrate and …
Self-supported ultra thin silicon wafer process
WR Morcom, SC Ahrens, JP Spindler, RT Ford… - US Patent …, 2000 - Google Patents
A silicon wafer 2 has an ultra thin central portion 2 that is supported by a circumferential rim
3 of thicker silicon. The central region is thinned by conventional means using conventional …
3 of thicker silicon. The central region is thinned by conventional means using conventional …
Thin flip-chip method
FB Grigg, TL Jackson - US Patent 6,905,946, 2005 - Google Patents
Methods for thinning a bumped semiconductor wafer, as well as methods for producing flip-
chips of very thin profiles, are disclosed. According to the methods of the present invention, a …
chips of very thin profiles, are disclosed. According to the methods of the present invention, a …
Interposers, electronic modules, and methods for forming the same
LM Racz, GB Tepolt, JC Thompson, TA Langdo… - US Patent …, 2012 - Google Patents
239; R Z39. Past al. 2008/0050916 A1 2/2008 Yonker et al. 6.774, 037 B3 8/2004 Hi, et al
2008/0076209 A1 3, 2008 Klink et al. 6.794, 741 B1 9/2004 Lineal 2008/0239683 A1 …
2008/0076209 A1 3, 2008 Klink et al. 6.794, 741 B1 9/2004 Lineal 2008/0239683 A1 …
Light emitting diode and method of making the same
KN Yang, TP Chen, CS Chang - US Patent 6,709,883, 2004 - Google Patents
(57) ABSTRACT A light emitting diode (LED) and method of making the same are disclosed.
The present invention uses a layer of elastic transparent adhesive material to bond a …
The present invention uses a layer of elastic transparent adhesive material to bond a …
Protection of work piece during surface processing
SM Kassir, LA Spiegel - US Patent 7,018,268, 2006 - Google Patents
451 (388 (58) Field of Classification Search.................... 45 1/5, The present invention
provides al apparatus and method for 451/41, 29, 31, 287. 290, 388, 36 protecting a work …
provides al apparatus and method for 451/41, 29, 31, 287. 290, 388, 36 protecting a work …
Thin-Film Device and Method of Fabricating The Same
K Najafi, EE Aktakka, H Kim - US Patent App. 12/819,827, 2011 - Google Patents
A thin-film device and a method of fabricating the thin-film device are provided herein. The
thin-film device comprises a bond layer, a film layer that has bulk material properties, and a …
thin-film device comprises a bond layer, a film layer that has bulk material properties, and a …