Challenges in material processing and reliability issues in AlGaN/GaN HEMTs on silicon wafers for future RF power electronics & switching applications: A critical …

J Ajayan, D Nirmal, P Mohankumar, B Mounika… - Materials Science in …, 2022 - Elsevier
In order to handle high power with good thermal stability at RF & microwave frequencies
wider bandgap semiconductor based transistors are highly desirable and GaN & AlGaN …

High transconductance organic electrochemical transistors

D Khodagholy, J Rivnay, M Sessolo, M Gurfinkel… - Nature …, 2013 - nature.com
The development of transistors with high gain is essential for applications ranging from
switching elements and drivers to transducers for chemical and biological sensing. Organic …

GaN HEMTs on Si with regrown contacts and cutoff/maximum oscillation frequencies of 250/204 GHz

L Li, K Nomoto, M Pan, W Li, A Hickman… - IEEE Electron …, 2020 - ieeexplore.ieee.org
This work demonstrates the high-frequency and high-power performance capacity of GaN
high electron mobility transistors (HEMTs) on Si substrates. Using a T-gate and-GaN …

Scaling behavior of InAlN/GaN HEMTs on silicon for RF applications

P Cui, Y Zeng - Scientific Reports, 2022 - nature.com
Due to the low cost and the scaling capability of Si substrate, InAlN/GaN high-electron-
mobility transistors (HEMTs) on silicon substrate have attracted more and more attentions. In …

High-performance AlN/GaN MISHEMTs on Si with in-situ SiN enhanced ohmic contacts for mobile mm-wave front-end applications

H Du, Z Liu, L Hao, W **ng, H Zhou… - IEEE Electron …, 2023 - ieeexplore.ieee.org
In this letter, we demonstrated an AlN/GaN metal-insulator-semiconductor high electron
mobility transistor (MISHEMT) on a Si substrate with in-situ SiN as gate dielectric with …

InAlN/GaN HEMT on Si with fmax= 270 GHz

P Cui, M Jia, H Chen, G Lin, J Zhang… - … on Electron Devices, 2021 - ieeexplore.ieee.org
Device surface properties are critical for its performance such as channel electron density,
leakage current, subthreshold swing (SS), and noise in gallium nitride high-electron-mobility …

W-band MMIC PA with ultrahigh power density in 100-nm AlGaN/GaN technology

W Shaobing, G Jianfeng, W Weibo… - IEEE Transactions on …, 2016 - ieeexplore.ieee.org
A three-stage W-band GaN monolithic microwave integrated circuit power amplifier (MMIC
PA) is reported. Electron-beam lithography has been employed to define a 100-nm T …

Scaled InAlN/GaN HEMT on Sapphire With fT/fmax of 190/301 GHz

Y He, L Zhang, Z Cheng, C Li, J He… - … on Electron Devices, 2023 - ieeexplore.ieee.org
In this brief, a scaled In Al/GaN high-electron-mobility transistor (HEMT) was fabricated on
sapphire substrate with 47-nm-gate length, 300-nm source–drain distance, and selective …

High-performance InAlN/GaN HEMTs on silicon substrate with high fT× Lg

P Cui, A Mercante, G Lin, J Zhang, P Yao… - Applied Physics …, 2019 - iopscience.iop.org
We report an 80 nm gate-length In 0.17 Al 0.83 N/GaN high-electron mobility transistor
(HEMT) on silicon substrate with a record low gate leakage current of 7.12× 10− 7 A mm− 1 …

Effects of gate length on GaN HEMT performance at room temperature

S Saadaoui, O Fathallah, H Maaref - Journal of Physics and Chemistry of …, 2022 - Elsevier
We report the electrical characteristics at room temperature of (Al, Ga) N/GaN high-electron-
mobility transistors with different gate lengths L g ranging from 0.15 to 2 μm. Static …