The miniaturization, integration, and high data throughput of electronic chips present
challenging demands on thermal management, especially concerning heat dissipation at …

Effective heat dissipation and real-time temperature monitoring are crucial for ensuring the
long-term stable operation of modern, high-performance electronic products. This study …

Electrically and thermally conductive polymer composites (CPCs) have promising
applications in flexible and wearable electronics, and it remains difficult for the trade-off …

Polymeric composites with boron nitride nanosheets (BNNs), which are thermally conductive
yet electrically insulating, have been pursued for a variety of technological applications …

The rising concern over the usage of electronic devices and the operating environment
requires efficient thermal interface materials (TIMs) to take away the excess heat generated …

Efforts to directly utilize thixotropic polymer composites for out-of-plane thermal transport
applications, known as thermal interface materials (TIMs), have been impeded by their …

This work represents a new composite film with a nacre-mimetic structure through the
alignment of hybrids comprising cellulose nanocrystals and ball-milled boron nitride (CNC …

To facilitate versatile application of polyimide (PI) under harsh conditions, the PI-PDA@
PSF@ TO coating was successfully developed. The results illustrate the successful …

Boron nitride nanosheets (BNNSs) with high thermal conductivity (TC) have promising
applications in the thermal conduction. However, the preparation of BNNSs is cumbersome …

With the miniaturization of electronic components and the complication of packaging
processes, operating environments with high power density are bound to generate large …