The development of miniaturization and high-density packaging of electronic components
demands heat dissipation components that are compact and exhibit high performance. An …

Portable electronic products are continuously evolving towards compactness, integration,
and high performance, resulting in electronic chips generating significant heat in a confined …

Light-emitting diodes (LEDs) are widely used in our daily lives. Both light and heat are
generated from LED chips and then transmitted or conducted through multiple packaging …

Heat pipes (HPs) have received considerable attention in recent decades, especially in the
field of cooling electronics, which requires the removal of added heat from an area of limited …

Flexible battery-type in-plane hybrid micro-supercapacitors (IHMSCs), which combine fast
charging rate of micro-supercapacitors and high energy density of batteries, provide great …

The advent of foldable and wearable devices, such as the Samsung Galaxy Fold (2019) and
Huawei Mate X (2019), require increased battery size and processor performance to drive …

Thermal ground planes (TGPs) are considered to be one the most promising thermal
management devices for cooling the high heat flux miniaturized power electronic devices …

Photovoltaic (PV) cells are able to absorb about 80% of the solar spectral irradiance,
however, certain percentage accounts for electricity conversion depending on the cell …

Ultra-thin vapor chamber (UTVC) is an efficient heat transfer element that meets the heat
dissipation requirement of miniaturized electronics. In this study, a novel UTVC (0.5 mm …

Condensation is a ubiquitous phenomenon in nature and industry. Heat transfer rates during
dropwise condensation on non-wetting substrates can be 6-8X higher than heat transfer …