[HTML][HTML] Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics
The mechanical reliability of the future miniaturized interconnects is mainly governed by the
intermetallic compounds such as Cu 6 Sn 5. Alloyed Cu 6 Sn 5 with various elements …
intermetallic compounds such as Cu 6 Sn 5. Alloyed Cu 6 Sn 5 with various elements …
Relationship between nanomechanical responses of interfacial intermetallic compound layers and impact reliability of solder joints
This study aims to evaluate solder joint reliability under high speed impact tests using
nanoindentation properties of intermetallic compounds (IMCs) at the joint interface. Sn–Ag …
nanoindentation properties of intermetallic compounds (IMCs) at the joint interface. Sn–Ag …
[HTML][HTML] Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging
O Golim, V Vuorinen, T Wernicke, M Pawlak… - Microelectronic …, 2024 - Elsevier
This work demonstrates the potential use of Cu-Sn-In metallurgy for wafer-level low-
temperature solid-liquid interdiffusion (LT-SLID) bonding process for …
temperature solid-liquid interdiffusion (LT-SLID) bonding process for …
In-situ compression tests and analysis of strength-ductility synergy in heterogeneous structured copper-tin composite joint
Q Xu, Y Cao, B Chen, J Zhou, F Xue - Materials Science and Engineering: A, 2024 - Elsevier
Abstract Copper-tin (Cu–Sn) serves as a prevalent alloy system in electronic packaging,
envisioned for future high-power device applications. However, interdiffusion in Cu–Sn …
envisioned for future high-power device applications. However, interdiffusion in Cu–Sn …
Mechanical characterizations of single-crystalline (Cu, Ni) 6Sn5 through uniaxial micro-compression
JY Wu, YS Chiu, YW Wang, CR Kao - Materials Science and Engineering: A, 2019 - Elsevier
Microelectronic industry is experiencing a major paradigm shift from the conventional two-
dimensional into hierarchical three-dimensional integrated circuits (3D ICs). In 3D IC …
dimensional into hierarchical three-dimensional integrated circuits (3D ICs). In 3D IC …
Formation mechanism and reliability of preferred growth full Cu6Sn5 intermetallic compound interconnect on (011) Cu single-crystal substrate
ML Huang, L Zou, Y Wu - Journal of Materials Science: Materials in …, 2022 - Springer
The preferred growth full intermetallic compound (IMC) interconnect was fabricated using
the current driven bonding (CDB) method. The morphology, orientation and growth …
the current driven bonding (CDB) method. The morphology, orientation and growth …
Effect of Au Do** on Elastic, Thermodynamic, and Electronic Properties of η-Cu6Sn5 Intermetallic
X Lin, W Zhang, Z Mao, Y Tian, X Jian, W Zhou… - Journal of Electronic …, 2020 - Springer
The effects of substitution of Au for Cu on the elastic, thermodynamic, and electronic
properties of hexagonal η-Cu 6 Sn 5 intermetallic compound (IMC) are investigated by first …
properties of hexagonal η-Cu 6 Sn 5 intermetallic compound (IMC) are investigated by first …
Mechanical reliability assessment of Cu_6Sn_5 intermetallic compound and multilayer structures in Cu/Sn interconnects for 3D IC applications
In recent decades, three-dimensional integrated circuit (3D IC) design has been developed
for the purpose of moving into a new era of More-than-Moore by vertical stacking and …
for the purpose of moving into a new era of More-than-Moore by vertical stacking and …
Shear localization and size-dependent strength of YCd6 quasicrystal approximant at the micrometer length scale
Mechanical properties of materials are strongly dependent of their atomic arrangement as
well as the sample dimension, particularly at the micrometer length scale. In this study, we …
well as the sample dimension, particularly at the micrometer length scale. In this study, we …
[PDF][PDF] Cu/Sn 系金属間化合物の変形特性評価のための材料試験法に関する研究
黒沢憲吾 - 2021 - air.repo.nii.ac.jp
電子実装基板では, 線膨張係数が異なる部材がはんだで接合されているため,
基板の周辺温度が変動すると, はんだ接合部に熱応力が生じる. これが繰返された場合 …
基板の周辺温度が変動すると, はんだ接合部に熱応力が生じる. これが繰返された場合 …