Visually inspecting integrated circuit (IC) wire bonding defects is important to ensuring the
product quality after the packaging process. The availability of IC X-ray images offers an …

This paper delves into the intricate scheduling strategies crucial for the final testing phase of
memory chip manufacturing within the semiconductor industry and other related sectors. It …

To address the challenges of complex backgrounds, small defect sizes, and diverse defect
types in defect detection of wire bonding X-ray images, this paper proposes a convolutional …

Dual-gantry surface mount optimization effectively improves the productivity of printed circuit
board assembly (PCBA), but also brings new challenges. Optimizing workload allocation to …

In semiconductor back‐end production, the die attach process is one of the most critical
steps affecting overall productivity. Optimization of this process can be modeled as a pick …

PCB Manufacturing process is a complex process and has several processes and sub-
processes. Adopting a lean manufacturing system will help to increase the efficiency of the …

Purpose A real-time production scheduling method for semiconductor back-end
manufacturing process becomes increasingly important in industry 4.0. Semiconductor back …

The process of ejecting and peeling the chip from the blue tape can easily lead to chip
damage. It is of great importance to realize positively synchronous control of motion and …

The stage of transporting semiconductor chips from the wafer to the support strip is crucial in
the integrated circuit manufacturing process. This process can be modeled as a …

The stage of transporting semiconductor chips from the wafer to the support strip is crucial in
the integrated circuit manufacturing process. This process can be modeled as a …