AlGaN/GaN-based HEMTs failure physics and reliability: Mechanisms affecting gate edge and Schottky junction

E Zanoni, M Meneghini, A Chini… - … on Electron Devices, 2013 - ieeexplore.ieee.org
This paper presents a comprehensive review of AlGaN/GaN high electron mobility transistor
failure physics and reliability, focusing on mechanisms affecting the gate-drain edge, where …

A current-transient methodology for trap analysis for GaN high electron mobility transistors

J Joh, JA Del Alamo - IEEE Transactions on Electron Devices, 2010 - ieeexplore.ieee.org
Trap** is one of the most deleterious effects that limit performance and reliability in GaN
HEMTs. In this paper, we present a methodology to study trap** characteristics in GaN …

Direct observation of 0.57 eV trap-related RF output power reduction in AlGaN/GaN high electron mobility transistors

AR Arehart, A Sasikumar, S Rajan, GD Via… - Solid-State …, 2013 - Elsevier
This paper reports direct evidence for trap-related RF output power loss in GaN high
electron mobility transistors (HEMTs) grown by metal organic chemical vapor deposition …

Lifetesting GaN HEMTs with multiple degradation mechanisms

BM Paine, SR Polmanter, VT Ng… - … on Device and …, 2015 - ieeexplore.ieee.org
A technique is described, to efficiently evaluate the reliability of an RF semiconductor device
when several different mechanisms contribute simultaneously to its wearout. This is of …

Slow detrap** transients due to gate and drain bias stress in high breakdown voltage AlGaN/GaN HEMTs

S DasGupta, M Sun, A Armstrong… - IEEE transactions on …, 2012 - ieeexplore.ieee.org
Charge trap** and slow (from 10 s to>; 1000 s) detrap** in AlGaN/GaN high electron
mobility transistors (HEMTs) designed for high breakdown voltages (>; 1500 V) is studied …

Off-state leakage and current collapse in AlGaN/GaN HEMTs: a virtual gate induced by dislocations

S Ghosh, S Das, SM Dinara, A Bag… - … on Electron Devices, 2018 - ieeexplore.ieee.org
The existence of a correlation between current collapse and off-state reverse-bias leakage
current in heteroepitaxially grown AlGaN/GaN high-electron-mobility transistors is …

A thorough evaluation of GaN HEMT degradation under realistic power amplifier operation

G Bosi, A Raffo, V Vadalà, R Giofrè, G Crupi, G Vannini - Electronics, 2023 - mdpi.com
In this paper, we experimentally investigate the effects of degradation observed on 0.15-µm
GaN HEMT devices when operating under realistic power amplifier conditions. The latter will …

Electroluminescence and transmission electron microscopy characterization of reverse-biased AlGaN/GaN devices

DA Cullen, DJ Smith, A Passaseo… - … on Device and …, 2012 - ieeexplore.ieee.org
Reverse-bias stress testing has been applied to a large set of more than 50 AlGaN/GaN high
electron mobility transistors, which were fabricated using the same process but with different …

Modeling of the gate leakage current in AlGaN/GaN HFETs

A Goswami, RJ Trew, GL Bilbro - IEEE Transactions on Electron …, 2014 - ieeexplore.ieee.org
A new physics-based model of the gate leakage current in AlGaN/GaN heterojunction field
effect transistors (HFETs) is demonstrated. The model predicts accurately the gate-leakage …

Electroluminescence of hot electrons in AlGaN/GaN high-electron-mobility transistors under radio frequency operation

T Brazzini, MA Casbon, H Sun, MJ Uren, J Lees… - Applied Physics …, 2015 - pubs.aip.org
Hot electrons in AlGaN/GaN high electron mobility transistors are studied during radio
frequency (RF) and DC operation by means of electroluminescence (EL) microscopy and …