Three-dimensional integrated circuits (3-D IC) technology has emerged in the past few
decades, driven in part by the techno-economic difficulties of dimensional scaling and the …

In this paper, the integrable (2+ 1)-dimensional Maccari system (MS), which can model
many complex phenomena in hydrodynamics, plasma physics and nonlinear optics, is …

On the integration of 3D IC design, thermal management issues play a significant role. So, it
is required to implement an effective approaches and solutions for integrating 3DIC. The …

The multilayer structure of 3-D network-on-chips (3-D NoC) leads to the unequal thermal
conductance between different layers and, as a result, an unbalanced thermal distribution in …

The die-stacking structure of 3D network-on-chips (3D NoC) leads to high power density and
unequal thermal conductance between different layers, which results in low reliability and …

Abstract Although many Dynamic Thermal Management (DTM) techniques are employed to
overcome thermal problems in 3D NoCs, none of them consider temperature information of …

Different stacked structures affect greatly the temperature distribution of a 3-D integrated
circuit, and an optimal structure is much needed to reduce the maximal temperature. This …

Flow cell arrays (FCAs) concurrently provide efficient on-chip liquid cooling and
electrochemical power generation. This technology is especially promising for 3-D …

Flow cell arrays (FCAs) provide efficient on-chip liquid cooling and electrochemical power
generation capabilities in three-dimensional multi-processor systems-on-chip (3D MPSoCs) …

This research work presents the implementation of a sophisticated Place and Route (PnR)
flow specifically tailored for block-level design in VLSI circuits. The primary focus is …