The ever-increasing demands of digital computing and wireless communication have been
driving the semiconductor technology to change with each passing day. Modern electronic …

Advances in interconnect technologies, such as the increase of the number of metal layers
and 3-D stacking technique, have paved the way for higher functionality and superior …

This paper presents a multilevel Model Order Reduction technique for a 3-D electromagnetic
Finite Element Method analysis. The reduction process is carried out in a hierarchical way …

3-D interconnect techniques in multilayer very large scale integration design, such as
stacked layers and various chip-stacking systems, have paved the way for the improvement …

A novel method to efficiently compute the interaction between two devices is proposed with
the aim of accurately reproducing radiated immunity and emission tests in simulations. The …

The constantly growing demand for accuracy, efficiency, dependency, and universality in the
simulation and circuit modeling of any functional electromagnetic structure-whether devices …

Efficient electromagnetic analysis for interconnect and packaging structures is developed by
solving surface integral equations (SIEs) with the method of moments. Since the SIEs …

In recent integrated circuit (IC) packages, the structure of the interconnect is highly complex,
and the effect of high-frequency parasitics is significant. These factors increase the number …

Electromagnetic analysis for interconnect and packaging structures usually relies on the
solutions of surface integral equations (SIEs) in integral equation solvers. Though the SIEs …

The fast-paced evolution of the semiconductor industry is putting forth great challenges on
electronic design automation tools. This thesis focuses on the efficient and accurate …