Atomic layer deposition (ALD) relies on alternated, self-limiting reactions between gaseous
reactants and an exposed solid surface to deposit highly conformal coatings with a thickness …

Thin film is a modern technology aimed at improving the structural, electrical, magnetic,
optical, and mechanical properties of bulk materials. This technology has so far found …

The atomic layer deposition (ALD) technique allows the synthesis of materials at the atomic
scale to be controlled. ALD has been adapted to design and prepare single-atom catalysts …

Atomic layer deposition (ALD) is gaining attention as a thin film deposition method, uniquely
suitable for depositing uniform and conformal films on complex three-dimensional …

Plasma-assisted atomic layer deposition (ALD) is an energy-enhanced method for the
synthesis of ultra-thin films with Å-level resolution in which a plasma is employed during one …

Atomic layer deposition (ALD) is a gas-phase deposition technique that, by relying on self-
terminating surface chemistry, enables the control of the amount of deposited material down …

Atomic layer deposition (ALD) is a technology offering the possibility to prepare thin films of
high quality materials on high aspect ratio substrates with precise thickness control, high …

Atomic layer deposition (ALD) is a cyclic process which relies on sequential self-terminating
reactions between gas phase precursor molecules and a solid surface. The self-limiting …

Metal–support interaction (MSI) has been widely recognized to be playing a pivotal role in
regulating the catalytic activity of various reactions. In this work, the degree of MSI between …

For plasma-assisted atomic layer deposition (ALD), reaching conformal deposition in high
aspect ratio structures is less straightforward than for thermal ALD due to surface …