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[HTML][HTML] Wide band gap devices and their application in power electronics
Power electronic systems have a great impact on modern society. Their applications target a
more sustainable future by minimizing the negative impacts of industrialization on the …
more sustainable future by minimizing the negative impacts of industrialization on the …
Next generation electric drives for HEV/EV propulsion systems: Technology, trends and challenges
In recent decades, several factors such as environmental protection, fossil fuel scarcity,
climate change and pollution have driven the research and development of a more clean …
climate change and pollution have driven the research and development of a more clean …
A review of silicon carbide CMOS technology for harsh environments
A comprehensive overview of the advancements, challenges, and prospects of silicon
carbide (SiC) complementary metal-oxide-semiconductor (CMOS) technology is presented …
carbide (SiC) complementary metal-oxide-semiconductor (CMOS) technology is presented …
Cascode GaN/SiC: A wide-bandgap heterogenous power device for high-frequency applications
Wireless power transfer systems and plasma generators are among the increasing number
of applications that use high-frequency power converters. Increasing switching frequency …
of applications that use high-frequency power converters. Increasing switching frequency …
Review of high-temperature power electronics converters
Power electronics converters operating at elevated temperature usually have degraded
performance, such as reduced efficiency, lower noise immunity, and decreased system …
performance, such as reduced efficiency, lower noise immunity, and decreased system …
Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications
In order to overcome interfacial delamination of pressureless sintered nanosilver as die
attachment on the ENIG finish, we tried to clarify the densification and interfacial diffusion …
attachment on the ENIG finish, we tried to clarify the densification and interfacial diffusion …
An integrated SiC CMOS gate driver for power module integration
With high-temperature power devices available, the support circuitry required for efficient
operation, such as a gate driver, is needed as part of a complete high-temperature solution …
operation, such as a gate driver, is needed as part of a complete high-temperature solution …
Stable operation of AlGaN/GaN HEMTs for 25 h at 400° C in air
Extreme environments such as the Venus atmosphere are among the emerging applications
that demand electronics that can withstand high-temperature oxidizing conditions. While …
that demand electronics that can withstand high-temperature oxidizing conditions. While …
Sintering dynamic evolution and enhancement mechanism of nano-Cu/boron nitride composite matrix with excellent mechanical properties from the atomic …
Boron nitride (BN) nanomaterials are widely employed to enhance the physical properties of
materials and are well-known in the design of composite structures. In this paper, molecular …
materials and are well-known in the design of composite structures. In this paper, molecular …
Microstructural evolution and performance of high-tin-content Cu40Sn60 (wt.%) core/shell powder TLPS bonding joints
This paper investigated the microstructure evolution and performance of high tin content
Cu@ Sn core/shell (60 wt% Sn) powder transient liquid phase sintering bonding. The …
Cu@ Sn core/shell (60 wt% Sn) powder transient liquid phase sintering bonding. The …