Thermal conductivity or heat dissipation of polymeric matrices is critical thermal feature for
both polymeric applications as well as process strategies. Polymeric matrices display …

The development of novel thermal management materials (TIMs) is crucial for advancing
GaN/SiC-driven high-power electronics, laser diodes, and RF electronics. Diamond …

A 20 nm SiC nanocoating was prepared on the surface of crushed diamond particles using a
combination of sol-gel and in situ reaction methods. 50 vol% SiC-coated diamond particles …

Diamond/aluminum composites, as a new generation of thermal management materials, are
caught in the dilemma between inhibiting the formation of Al 4 C 3 and improving the …

The stability of the thermal properties of diamond/Al composites during thermal cycling is
crucial to their thermal management applications. In this study, we realize a well-bonded …

In response to the rapid development of high-performance electronic devices, diamond/Al
composites with high thermal conductivity (TC) have been considered as the latest …

Carbon materials have excellent thermophysical properties, and different dimensions of
carbon materials are attractive candidates for enhancing high-performance aluminum matrix …

Three-dimensional graphene networks (3DGN) have the potential to be used as a
reinforcement for aluminum matrix composites due to their unique wrinkled structure and …

High-content diamond/Al composites have great potential for application as heat dissipation
substrates in high-power electronic devices due to their superior thermal properties. This …

Diamond/SiC (Dia/SiC) composites possess excellent properties, such as high thermal
conductivity and low thermal expansion coefficient. In addition, they are suitable as …