Diamond/GaN HEMTs: where from and where to?

JC Mendes, M Liehr, C Li - Materials, 2022 - mdpi.com
Gallium nitride is a wide bandgap semiconductor material with high electric field strength
and electron mobility that translate in a tremendous potential for radio-frequency …

Chip-level thermal management in GaN HEMT: Critical review on recent patents and inventions

MF Abdullah, MRM Hussin, MA Ismail… - Microelectronic …, 2023 - Elsevier
The technological development of GaN high electron mobility transistor (HEMT) is on the
right track to compete with Si and SiC-based power transistors for the market segment of> …

Record-low thermal boundary resistance between diamond and GaN-on-SiC for enabling radiofrequency device cooling

M Malakoutian, DE Field, NJ Hines… - … Applied Materials & …, 2021 - ACS Publications
The implementation of 5G-and-beyond networks requires faster, high-performance, and
power-efficient semiconductor devices, which are only possible with materials that can …

Synthesis of nano-diamond film on GaN surface with low thermal boundary resistance and high thermal conductivity

Z Hao, K Huang, K Deng, F Sun, J Liu, L Chen… - Carbon, 2024 - Elsevier
Joule self-heating is the main obstacle limiting the performance of GaN power devices. A
nano-diamond (NCD) film for near-junction heat transfer has been approved as an effective …

Mechanical properties and microstructure of large-area diamond/silicon bonds formed by pressure-assisted silver sintering for thermal management

K Zhao, J Zhao, X Wei, X Zhang, C Deng… - Materials Today …, 2023 - Elsevier
Ag sinter pastes comprising Ag nano/microparticles in an organic binder exhibit many
advantages for electronic packaging, such as a low sintering temperature (< 300° C), high …

Seed dibbling method for the growth of high-quality diamond on GaN

R Soleimanzadeh, M Naamoun… - … Applied Materials & …, 2021 - ACS Publications
The integration of diamond and GaN has been highly pursued for thermal management
purposes as well as combining their exceptional complementary properties for power …

Thermal Management Modeling for β-Ga2O3-Highly Thermal Conductive Substrates Heterostructures

G Wang, Y Zhou - IEEE Transactions on Components …, 2022 - ieeexplore.ieee.org
The ultrawide-bandgap (UWBG)(~ 4.8 eV) semiconductor-gallium oxide (-Ga 2 O 3) gives
promise to the next generation of high-power electrical devices owing to its high-power …

Enablers for overcurrent capability of silicon-carbide-based power converters: An overview

S Bhadoria, F Dijkhuizen, R Raj, X Wang… - IEEE transactions on …, 2022 - ieeexplore.ieee.org
With the increase in penetration of power electronic converters in the power systems, a
demand for overcurrent/overloading capability has risen for the fault clearance duration. This …

Development of Diamond Device-Level Heat Spreader for the Advancement of GaN HEMT Power and RF Electronics

MC Lu - IEEE Transactions on Device and Materials Reliability, 2023 - ieeexplore.ieee.org
Wide bandgap power electronics have been commercialized for many applications. Gallium
nitride (GaN) high electron mobility transistor (HEMT) has superior performance in high …

Applications of machine learning in computational nanotechnology

W Liu, Y Wu, Y Hong, Z Zhang, Y Yue… - Nanotechnology, 2022 - iopscience.iop.org
Abstract Machine learning (ML) has gained extensive attention in recent years due to its
powerful data analysis capabilities. It has been successfully applied to many fields and …