A review of switching slew rate control for silicon carbide devices using active gate drivers

S Zhao, X Zhao, Y Wei, Y Zhao… - IEEE Journal of …, 2020‏ - ieeexplore.ieee.org
Driving solutions for power semiconductor devices are experiencing new challenges since
the emerging wide bandgap power devices, such as silicon carbide (SiC), with superior …

Aging mechanisms and accelerated lifetime tests for SiC MOSFETs: An overview

S Pu, F Yang, BT Vankayalapati… - IEEE Journal of Emerging …, 2021‏ - ieeexplore.ieee.org
Accelerated lifetime tests (ALTs) play a critical role in long-term reliability studies of SiC
MOSFETs, including lifetime estimation, failure analysis, and condition monitoring. This …

A review of voltage/current sharing techniques for series–parallel-connected modular power conversion systems

D Ma, W Chen, X Ruan - IEEE Transactions on Power …, 2020‏ - ieeexplore.ieee.org
Recently, more occasions with high input voltage and/or high output voltage applications are
emerging. However, the existing switching devices are limited by the voltage stress, eg, the …

Active gate driver for dynamic current balancing of parallel-connected SiC MOSFETs

Y He, X Wang, S Shao, J Zhang - IEEE Transactions on Power …, 2023‏ - ieeexplore.ieee.org
In high-power applications, parallel connection of discrete silicon carbide (SiC) mosfets is
necessary to increase the current rating. However, the unbalanced dynamic current during …

Imbalance current analysis and its suppression methodology for parallel SiC MOSFETs with aid of a differential mode choke

Z Zeng, X Zhang, Z Zhang - IEEE Transactions on Industrial …, 2019‏ - ieeexplore.ieee.org
Parallel connection of silicon carbide (SiC) MOSFETs is a cost-effective solution for high-
capacity power converters. However, transient imbalance current, during turn-on and-off …

Balancing of peak currents between paralleled SiC MOSFETs by drive-source resistors and coupled power-source inductors

Y Mao, Z Miao, CM Wang… - IEEE Transactions on …, 2017‏ - ieeexplore.ieee.org
The peak currents between two paralleled SiC MOSFETs could differ significantly due to the
mismatch in threshold voltages V th. The method described herein employs passive …

Layout-dominated dynamic current imbalance in multichip power module: Mechanism modeling and comparative evaluation

Z Zeng, X Zhang, X Li - IEEE Transactions on Power …, 2019‏ - ieeexplore.ieee.org
The multichip power module is an irreplaceable component for high-capacity industrial
converters. Dynamic current imbalance among parallel chips challenges the electrothermal …

Single-pulse avalanche mode robustness of commercial 1200 V/80 mΩ SiC MOSFETs

MD Kelley, BN Pushpakaran… - IEEE Transactions on …, 2016‏ - ieeexplore.ieee.org
Commercialization of 1200-V silicon carbide (SiC) MOSFET has enabled power electronic
design with improved efficiency as well as increased power density. High-voltage spikes …

Design and evaluation of laminated busbar for three-level T-type NPC power electronics building block with enhanced dynamic current sharing

Z Yuan, H Peng, A Deshpande… - IEEE Journal of …, 2019‏ - ieeexplore.ieee.org
This article focuses on providing the laminated busbar design guidance for a three-level T-
type neutral-pointclamped (3L-TNPC) inverter to achieve low stray inductance and balanced …

A Novel Non-Intrusive Technique for BTI Characterization in SiC mosfets

JAO Gonzalez, O Alatise - IEEE Transactions on Power …, 2018‏ - ieeexplore.ieee.org
Threshold voltage (VTH) shift due to bias temperature instability (BTI) is a well-known
problem in SiC mosfets that occurs due to oxide traps in the SiC/SiO2 gate interface. The …