With the advancement of Moore's Law reaching its limits, advanced packaging technologies
represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and …

The advance of semiconductor technology not only enables integrated circuits with higher
density and better performance but also increases their vulnerability to various aging …

As the feature size of Cu interconnects in microelectronic devices are miniaturized into micro-
and even nano-scale, the effects of grain boundaries (GBs) on the electromigration (EM) …

Electromigration is one of the most important research issues affecting the reliability of
solder joints. Current-induced Joule heating affects the electromigration behavior of solder …

As integrated circuit technologies move below 10 nm, Electromigration (EM) has become an
issue of great concern for the longterm reliability due to the stricter performance, thermal and …

Electromigration (EM) is one of the major concerns in the reliability analysis of very large-
scale integration (VLSI) systems due to the continuous technology scaling. Accurately …

Temperature gradient due to Joule heating has huge impacts on the electromigration (EM)
induced failure effects. However, Joule heating and related thermomigration (TM) effects …

The electromigration-induced reliability issues (EM) in very large scale integration (VLSI)
circuits have attracted continuous attention due to technology scaling. Traditional EM …

Traditional approaches to analyzing electromigration (EM) in on-chip interconnects are
largely driven by semi-empirical models. However, such methods are inexact for the typical …

Electromigration (EM) has become one of the most significant challenges considering
longterm reliability in integrated circuit design. The problem is caused by the large current …