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Science and art of ductile grinding of brittle solids
Prior to any practical application, brittle material components may need to be machined to a
high degree of precision in order to avoid functional breakdown as well as to maintain …
high degree of precision in order to avoid functional breakdown as well as to maintain …
Material removal mechanism and corresponding models in the grinding process: A critical review
Grinding is a key technology for difficult-to-machine materials, eg, super alloys, ceramics,
and composites. The material removal behavior is dependent on almost all grinding …
and composites. The material removal behavior is dependent on almost all grinding …
[HTML][HTML] Brittle-to-ductile transition in nanoscratching of silicon and gallium arsenide using Berkovich and Conical tips
Determining the brittle-to-ductile transition (BDT) threshold is crucial for develo** efficient
machining processes for brittle materials. In this study, nanoscratch tests were performed on …
machining processes for brittle materials. In this study, nanoscratch tests were performed on …
Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding
S Agarwal, PV Rao - International Journal of Machine Tools and …, 2008 - Elsevier
The difficulty and cost involved in the abrasive machining of hard and brittle ceramics are
among the major impediments to the widespread use of advanced ceramics in industries …
among the major impediments to the widespread use of advanced ceramics in industries …
[HTML][HTML] Material removal mechanism of laser-assisted grinding of RB-SiC ceramics and process optimization
Laser-assisted grinding (LAG) is a promising method for cost-effective machining of hard
and brittle materials. Knowledge of material removal mechanism and attainable surface …
and brittle materials. Knowledge of material removal mechanism and attainable surface …
Atomistic simulation on the removal mechanism of monocrystal silicon carbide with textured surface nano-machining in water lubrication
H Dai, W Wu, P Li - Journal of Manufacturing Processes, 2023 - Elsevier
A new machining method that combines textured surface and water lubrication is proposed
in this paper to improve the friction characteristics of ground silicon carbide (SiC). The effects …
in this paper to improve the friction characteristics of ground silicon carbide (SiC). The effects …
Surface roughness modeling for grinding of silicon carbide ceramics considering co-existence of brittleness and ductility
C Wu, B Li, Y Liu, SY Liang - International Journal of Mechanical Sciences, 2017 - Elsevier
Ground surface roughness is always hard to be predicted due to the random distribution of
abrasive grits and various materials properties, especially for brittle materials. In grinding of …
abrasive grits and various materials properties, especially for brittle materials. In grinding of …
The influence of speed on material removal mechanism in high speed grinding with single grit
L Tian, Y Fu, J Xu, H Li, W Ding - International Journal of Machine Tools …, 2015 - Elsevier
In this paper, the effect of speed on material removal was investigated by single grit grinding
of the GH4169 super alloy which is difficult to machine, with a new test method. During the …
of the GH4169 super alloy which is difficult to machine, with a new test method. During the …
Surface generation in high-speed grinding of brittle and tough ceramics
Grinding induced sub-surface defects substantially impair the functionality of ceramic
components. Effective control of such defects is possible through identification and …
components. Effective control of such defects is possible through identification and …
Nanoscale removal mechanisms in abrasive machining of brittle solids
H Shuiquan, GAO Shang, H Chuanzhen… - 金刚石与磨料磨具 …, 2022 - daemagazine.com
Brittle solids with dominant covalent-ionic bonding, including single crystals, polycrystals,
and optical glass, are core materials for modern microelectronic and optoelectronic devices …
and optical glass, are core materials for modern microelectronic and optoelectronic devices …