For the past couple of decades, a considerable amount of time and effort has been spent to
enhance the predictability of warpage of semiconductor packages encapsulated by epoxy …

This paper reviews predictive models developed for the development of residual stresses
and shape distortions during the manufacturing of thermoset polymeric/composite materials …

Nowadays, fan-out package is regarded as one of the latest and most potential technologies
because it possesses lower cost, thinner profile, and better electrical performance and …

Shape memory polymer composites (SMPCs) are being evaluated for aerospace
applications due to their lightweight and ease of self-deployment. For such applications, the …

In this article, a novel fan-out panel-level printed circuit board (PCB)-embedded package for
phase-leg silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) …

In the electronics industry epoxy molding compounds, underfills and adhesives are used for
the packaging of electronic components. These materials are applied in liquid form, cured at …

Carbon fiber-reinforced shape memory polymer composites (CF-SMPCs) have been
researched as a potential next-generation material for aerospace application, due to their …

This paper presents a warpage analysis method that predicts the warpage behavior of
electroplated Cu films on glass fiber-reinforced polymer (GFRP) packaging substrates. The …

Highly filled thermosets are widely used to encapsulate chips in the semiconductor
packaging industry. A complete set of viscoelastic properties are required for package …

A thermoset coating that is applied to an elastic substrate will develop residual stresses
during curing because of polymerization shrinkage of the resin. This shrinkage only partly …