A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging
Abstract In recent years, Cu–Sn solid–liquid interdiffusion (SLID) bonding has been used in
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …
semiconductor packaging, die-attach, fine-pitch interconnection, and through-silicon vias …
Improvement in energy channelization behaviour during micro hole formation in Y-SZ ceramic with magnetic field assisted ECSM process
In the present investigation, an energy channelization behavior was improved while
machining micro holes in the Yttria–stabilized zirconia (Y-SZ) under magneto hydrodynamic …
machining micro holes in the Yttria–stabilized zirconia (Y-SZ) under magneto hydrodynamic …
Parametric Study of RSM Modelling and Multiresponse Optimization of Milling Electrochemical Spark Micromachining (M-ECSMM) for Microchannel Fabrication on …
K Sahai, A Narayan - Arabian Journal for Science and Engineering, 2024 - Springer
Silicon wafers find applications in manufacturing large-scale micro-components widely
available in consumer-based electronic devices. The milling-electrochemical spark …
available in consumer-based electronic devices. The milling-electrochemical spark …
Electrochemical Discharge Machining
With the advancement in the miniaturization of electronic components, the requirement for
the micromachining of electrically non-conductive substrates has become more important …
the micromachining of electrically non-conductive substrates has become more important …