Comprehensive review and future prospects on chip-scale thermal management: Core of data center's thermal management

Z Li, H Luo, Y Jiang, H Liu, L Xu, K Cao, H Wu… - Applied Thermal …, 2024 - Elsevier
Data centers are increasingly important for global societal and economic advancement. The
reliable operation of data centers depends on robust thermal management systems for …

A review on transient thermal management of electronic devices

J Mathew, S Krishnan - Journal of Electronic …, 2022 - asmedigitalcollection.asme.org
Much effort in the area of electronics thermal management has focused on develo**
cooling solutions that cater to steady-state operation. However, electronic devices are …

Phase-change materials for thermal management of electronic devices

V Bianco, M De Rosa, K Vafai - Applied Thermal Engineering, 2022 - Elsevier
The increase in power density of electronic devices, driven by the higher performance and
miniaturization demands, has led researchers seek new and alternative thermal …

Investigation of Z-type manifold microchannel cooling for ultra-high heat flux dissipation in power electronic devices

S Yang, J Li, B Cao, Z Wu, K Sheng - … Journal of Heat and Mass Transfer, 2024 - Elsevier
Ultra-high heat flux (up to 1000 W/cm 2) thermal management has been an urgent need for
advanced power electronic devices to maintain their superior electrical performance and …

Comprehensive review and state of development of double-sided cooled package technology for automotive power modules

M Liu, A Coppola, M Alvi… - IEEE Open Journal of …, 2022 - ieeexplore.ieee.org
Power modules are core components of inverters in electric vehicles and their packaging
technology has a critical impact on system performance and reliability. Conventional single …

A comprehensive review on thermal management of electronic devices

AR Dhumal, AP Kulkarni, NH Ambhore - Journal of Engineering and …, 2023 - Springer
In the field of electronics thermal management (TM), there has already been a lot of work
done to create cooling options that guarantee steady-state performance. However …

Distributed thermal modeling for power devices and modules with equivalent heat flow path extraction

X Yang, S Xu, K Heng, X Wu - IEEE Journal of Emerging and …, 2023 - ieeexplore.ieee.org
Dynamic temperature information at critical locations has been a critical indicator to safely
use power devices and modules; however, most of the existing 3-D thermal modeling …

Overview of current thermal management of automotive power electronics for traction purposes and future directions

S Jones-Jackson, R Rodriguez, Y Yang… - IEEE Transactions …, 2022 - ieeexplore.ieee.org
The design of the thermal management solution has a significant impact on the reliability
and power density of power electronics (PEs). As the electric vehicle (EV) industry moves …

Insulation materials and systems for more-and all-electric aircraft: A review identifying challenges and future research needs

M Borghei, M Ghassemi - IEEE Transactions on Transportation …, 2021 - ieeexplore.ieee.org
In recent decades, extensive research has been conducted on the electrification of
commercial aircraft to reduce the dependence on mechanical, hydraulic, and pneumatic …

Power module electronics in HEV/EV applications: New trends in wide-bandgap semiconductor technologies and design aspects

A Matallana, E Ibarra, I López, J Andreu… - … and Sustainable Energy …, 2019 - Elsevier
A large number of factors such as the increasingly stringent pollutant emission policies,
fossil fuel scarcity and their price volatility have increased the interest towards the partial or …