Interfacial thermal resistance: Past, present, and future

J Chen, X Xu, J Zhou, B Li - Reviews of Modern Physics, 2022 - APS
Interfacial thermal resistance (ITR) is the main obstacle for heat flows from one material to
another. Understanding ITR becomes essential for the removal of redundant heat from fast …

Thermal conductivity of amorphous materials

WX Zhou, Y Cheng, KQ Chen, G **e… - Advanced Functional …, 2020 - Wiley Online Library
Thermal conductivity is one of the most fundamental properties of solid materials. The
thermal conductivity of ideal crystal materials has been widely studied over the past …

Machine learning approaches for thermoelectric materials research

T Wang, C Zhang, H Snoussi… - Advanced Functional …, 2020 - Wiley Online Library
Thermoelectric (TE) materials provide a solid‐state solution in waste heat recovery and
refrigeration. During the past few decades, considerable effort has been devoted towards …

Enhancing thermal transport across diamond/graphene heterostructure interface

Y Liu, L Qiu, J Liu, Y Feng - International Journal of Heat and Mass Transfer, 2023 - Elsevier
The thermal properties of two-dimensional materials and their heterostructure are critical for
efficient heat dissipation in nano-devices. A good example is graphene which exhibits …

Manipulating interfacial thermal conduction of 2D janus heterostructure via a thermo‐mechanical coupling

K Ren, H Qin, H Liu, Y Chen, X Liu… - Advanced Functional …, 2022 - Wiley Online Library
Abstract 2D Janus transition metal dichalcogenide (TMD) semiconductor materials have
attracted great interest for their potential applications. Because of the increased requirement …

Thermal transport in 2D semiconductors—considerations for device applications

Y Zhao, Y Cai, L Zhang, B Li, G Zhang… - Advanced Functional …, 2020 - Wiley Online Library
The discovery of graphene has stimulated the search for and investigations into other 2D
materials because of the rich physics and unusual properties exhibited by many of these …

Regulated thermal boundary conductance between copper and diamond through nanoscale interfacial rough structures

Z Wang, F Sun, Z Liu, L Zheng, D Wang… - ACS Applied Materials …, 2023 - ACS Publications
Interfacial structure optimization is important to enhance the thermal boundary conductance
(TBC) as well as the overall performance of thermal conductive composites. In this work, the …

In-plane and interfacial thermal conduction of two-dimensional transition-metal dichalcogenides

Y Yu, T Minhaj, L Huang, Y Yu, L Cao - Physical Review Applied, 2020 - APS
We elucidate the dependence of the in-plane and interfacial thermal conduction of two-
dimensional (2D) transition-metal dichalcogenide (TMDC) materials (including Mo S 2, WS …

Interfacial engineering for the enhancement of interfacial thermal conductance in GaN/AlN heterostructure

Q Wang, X Wang, X Liu, J Zhang - Journal of Applied Physics, 2021 - pubs.aip.org
Effective heat dissipation is the bottleneck problem for the development and
commercialization of GaN-based high-power electronic and photonic devices. To address …

Significantly Enhanced Interfacial Thermal Conductance across GaN/Diamond Interfaces Utilizing AlxGa1–xN as a Phonon Bridge

K Wu, G Chang, J Ye, G Zhang - ACS Applied Materials & …, 2024 - ACS Publications
Improving the thermal conductance at the GaN/diamond interface is crucial for boosting GaN-
based device performance and reliability. In this study, first-principles calculations and …