This article presents a packaging technique for monolithic microwave integrated circuits
(MMIC) demonstrated in a fully integrated receiver (Rx) module at the D-band (110-170 …

This paper presents waveguide interconnects implemented in an embedded wafer level ball
grid array (eWLB) packaging technology. The interconnects operate at D-band (110-170 …

This work presents a waveguide transition based on a slot radiator implemented on liquid
crystal polymer (LCP) substrate. The slot couples the RF signal to a D-band (110-170 GHz) …

This PhD thesis entitled “Integrated photonics for millimetre wave transmitters and receivers”
aimed at investigating the possibility of employing the uni-traveling carrier photodiode (UTC …

This Letter presents a non‐galvanic D‐band (110–170 GHz) interconnect realised in
embedded wafer level ball grid array (eWLB) packaging technology. The interconnect …

This work presents a packaging solution at F-band (90-140 GHz) using on-chip waveguide
transition. The transition is realized using a Linearly Tapered Slot (LTS) implemented in a …

This paper presents the design and characterisation of a two G-band (140-220 GHz)
fundamental mixers. The mixers are implemented in a 130-nm indium phosphide (InP) …

Fueled by the increasing demand for higher data rates, millimeter-wave (mmW) systems
emerged as a candidate that can provide multi-gigabit per second (Gb/s) transmission. This …