It is challenging to manufacture large‐area, ultrathin, flexible/stretchable electronics on an
industrial scale. Recent ground‐breaking advances in the manufacture of flexible electronics …

Transfer printing that enables heterogeneous integration of materials in desired layouts
offers unprecedented opportunities for develo** high-performance unconventional …

This paper presents an efficient analytical solution strategy to determine the adhesive
stresses in balanced and unbalanced adhesively bonded joints with mixed force loading …

Micro-LED display, which is regarded as the next-generation display technology, has
obtained immense attention and great development during the past 2 decades. Mass …

Flip chip packaging as a mainstream packaging interconnect technology has proliferated
rapidly within the last decade or so. With the applications of high-performance chip, its …

The ultra-miniaturization trend of chips presents new challenges for non-destructive peeling-
off techniques. This study models the mini-LED chip-UV film adhesive system as a micro …

The precise evaluation of fracture strength of ultrathin (< 50 μm thick) silicon chips/ribbons
plays a critical role in design of deformability and lifetime of flexible/stretchable electronics …

A 3D analytical approach is proposed to investigate the peeling mechanism of IC chip from
substrate, which is important for reliable electronic packaging. Chip-adhesive-substrate …

This study examines changes in CEOs' incentive to manage their firms' reported earnings
during their tenure. Earnings overstatement is greater in the early years than in the later …

Successful chip peeling from a substrate facilitates the transfer process for obtaining the final
functional chips, but remains a challenge in the practical production of ultra-thin chips …