Due to continuous miniaturization and increasing number of electrical components in
electronics, copper interconnections have become critical for the design of 3D integrated …

Diffusion barrier properties of very thin sputtered Ta and reactively sputtered TaN films used
as a barrier layer between Cu and Si substrates were investigated using electrical …

Frequency and temperature dependence of dielectric constant\varepsilon'and dielectric
loss\varepsilon" in pure polyester resin and polymer composites with various types of glass …

The main chemical aspects of the preparation of thin copper films from the vapour of
monovalent and divalent copper derivatives as precursors in the CVD technique are …

The present invention generally provides a precleaning process prior to metallization for
submicron features on substrates. The method includes cleaning the submicron features …

Alumina silicate powder which is extracted from the obsolete spark plug NGK (insulator part
as a filler) has been used to produce epoxy/alumina silicate composite. The dielectric …

Copper chemical mechanical polishing (Cu-CMP) was investigated using slurries containing
alumina abrasive and various types and concentrations of oxidizer, as well as …

Nanosensors play an irreplaceable role in environmental and health monitoring fields.
Single-function sensor can't meet the application requirements of increasingly complicated …

The electrical and dielectric properties of reactively sputtered Ta2O5 thin films with Cu as the
top and bottom electrodes forming a simple metal insulator metal (MIM) structure …

Nano-porous carbon doped oxide (CDO) is one of the potential low dielectric constant (low-
k) materials that can achieve a dielectric constant as low as 2.2 and is expected to be …