Accelerated temperature cycling induced strain and failure behaviour for BGA assemblies of third generation high Ag content Pb-free solder alloys
In severe operation environments where extreme thermal cycles and long dwells are
common, such as the engine compartment of motor vehicles, solder alloys resistant to …
common, such as the engine compartment of motor vehicles, solder alloys resistant to …
Electrochemical corrosion behaviour and corrosion mechanism of Sn-9Zn-xGe solder alloys in NaCl solution
C Pu, C Li, Y Miao, Q Lu, J Peng, Z Xu, X Zhang, J Yi - Corrosion Science, 2024 - Elsevier
The electrochemical corrosion behaviour and corrosion mechanism of Sn-9Zn-xGe alloy in
3.5 wt.% NaCl solution was investigated using electrochemical techniques combined with …
3.5 wt.% NaCl solution was investigated using electrochemical techniques combined with …
Improved reliability and mechanical performance of Ag microalloyed Sn58Bi solder alloys
Ag microalloyed Sn58Bi has been investigated in this study as a Pb-free solder candidate to
be used in modern electronics industry in order to cope with the increasing demands for low …
be used in modern electronics industry in order to cope with the increasing demands for low …
Effects of trace addition of Fe on the thermal, microstructure, and tensile creep properties of Sn-0.7 Cu eutectic alloy
This current research explores the impact of adding a minor amount of Fe on the thermal,
microstructure, and creep features of the Sn-0.7 Cu (SC07) eutectic alloy. A series of Sn-0.7 …
microstructure, and creep features of the Sn-0.7 Cu (SC07) eutectic alloy. A series of Sn-0.7 …
Comparison of intermetallic compound growth and tensile behavior of Sn-3.0 Ag-0.5 Cu/Cu solder joints by conventional and microwave hybrid heating
Microwave hybrid heating (MHH) is a possible approach for soldering; yet, the long-term
reliability of solder joints is still unclear. In this work, a comparative study was carried out on …
reliability of solder joints is still unclear. In this work, a comparative study was carried out on …
Microstructure changes in Sn-Bi solder joints reinforced with Zn@ Sn particles in thermal cycling and thermomigration
W Fengyi, LV Ziwen, L Sun, C Hongtao… - Journal of the Taiwan …, 2023 - Elsevier
Background In the field of electronic packaging, Sn-58Bi solder paste is a promising low-
temperature option for step soldering. However, the tendency for the Bi-rich phase to …
temperature option for step soldering. However, the tendency for the Bi-rich phase to …
Enhancing the ductility and mechanical behavior of Sn-1.0 Ag-0.5 Cu lead-free solder by adding trace amount of elements Ni and Sb
AE Hammad - Microelectronics Reliability, 2018 - Elsevier
The present paper investigates the microstructural and mechanical properties of Sn-1.0 Ag-
0.5 Cu (SAC105) solder alloy with 0.06 wt% Ni and 0.5 wt% Sb additions. The study …
0.5 Cu (SAC105) solder alloy with 0.06 wt% Ni and 0.5 wt% Sb additions. The study …
Effects of Bi addition on the solderability and mechanical properties of Sn-Zn-Cu lead-free Solder
C Pu, J Qiu, C Li, P Gao, Y Peng, Q He, H Bai… - Journal of Electronic …, 2022 - Springer
In the present work, the effects of Bi addition on the microstructure, solderability, and
mechanical properties of Sn-Zn-Cu lead-free solder were studied. The composition of Sn-Zn …
mechanical properties of Sn-Zn-Cu lead-free solder were studied. The composition of Sn-Zn …
Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry
Y Peng, C Li, K **ao, J Yang, C Pu, P Gao, S Guo… - Microelectronics …, 2022 - Elsevier
In this work, we developed Ga-doped Sn-based solders for the microelectronics industry.
The microstructures, melting properties, wetting performance, electrical conductivities …
The microstructures, melting properties, wetting performance, electrical conductivities …
Structural and thermal properties of Sn–Ag alloys
Microstructure and thermal properties of slowly cooled Sn–10% Ag and Sn–20% Ag alloys
were experimentally investigated in this study. It was found that microstructure of the studied …
were experimentally investigated in this study. It was found that microstructure of the studied …