The oxidation behavior of Cu-Fe-based immiscible alloy produced by laser powder bed
fusion at 500° C∼ 700° C were analyzed. The results show that the Cu-, Fe-, and Cr-rich …

Bimetallic Cu–Ag conductive structures hold great promise in integrating flexible electronics,
but fabrication of these structures requires complex multistep processes with poor …

Although cost‐effective copper inks show great potential in printed flexible electronics, the
poor stability and high sintering temperatures have hindered their practical application …

Sintered Cu interconnection suffers from an oxidation issue in high temperature applications
so that understanding the oxidation mechanism is vital for joint design. This study …

The nano-interface formed by bimetallic Cu@ Ag nanoparticles (NPs) on a TiO 2 surface
enhances charge separation through plasmonic heterojunctions. These bimetallic Cu@ Ag …

This short communication found thermal-deformation is effective in facilitating the dissolve of
TiC, Ti 5 Si 3 reinforcement and the transformation of β-to-α s, refining primary α through the …

Direct printing of flexible Cu traces is one of the most promising additive manufacturing
technologies in advanced electronics because it is a cost-effective and environmentally …

Ag-Cu bimetallic nanoalloy, integrating the advantages of reducing migration and cost of
nano-Ag and alleviating oxidation of nano-Cu, is a prospective bonding material for power …

Bonding applications for power semiconductors using copper (Cu) paste based sintering
have not been reached to become commercially viable over the past decade because …

In electronic packaging industry, it has been reported that compared with nano silver and
nano copper, the complementation and coordination of Ag and Cu components enable …