Electrocoagulation and advanced electrocoagulation processes: A general review about the fundamentals, emerging applications and its association with other …
S Garcia-Segura, MMSG Eiband, JV de Melo… - Journal of …, 2017 - Elsevier
The electrocoagulation (EC) process is an electrochemical means of introducing coagulants
and removing suspended solids, colloidal material, and metals, as well as other dissolved …
and removing suspended solids, colloidal material, and metals, as well as other dissolved …
A review of semiconductor wastewater treatment processes: Current status, challenges, and future trends
Semiconductor wastewater has recently become an emerging issue with the development of
semiconductor production owing to its severe toxicity and complexity. The increasing …
semiconductor production owing to its severe toxicity and complexity. The increasing …
The impact of engineered nanomaterials on the environment: Release mechanism, toxicity, transformation, and remediation
The presence and longevity of nanomaterials in the ecosystem, as well as their properties,
account for environmental toxicity. When nanomaterials in terrestrial and aquatic systems …
account for environmental toxicity. When nanomaterials in terrestrial and aquatic systems …
Electro-coagulation–flotation process for algae removal
S Gao, J Yang, J Tian, F Ma, G Tu, M Du - Journal of hazardous materials, 2010 - Elsevier
Algae in surface water have been a long-term issue all over the world, due to their adverse
influence on drinking water treatment process as well as drinking water quality. The algae …
influence on drinking water treatment process as well as drinking water quality. The algae …
Surfactant aided electrocoagulation/flotation using punched electrodes for the remediation of salicylic acid from wastewater
Performance of a batch electrocoagulation/floatation (ECF) setup using punched aluminium
electrodes for the remediation of salicylic acid in the presence of cetyl-trimethyl ammonium …
electrodes for the remediation of salicylic acid in the presence of cetyl-trimethyl ammonium …
A review on precision polishing technology of single-crystal SiC
G Ma, S Li, F Liu, C Zhang, Z Jia, X Yin - Crystals, 2022 - mdpi.com
Single-crystal SiC is a typical third-generation semiconductor power-device material
because of its excellent electronic and thermal properties. An ultrasmooth surface with …
because of its excellent electronic and thermal properties. An ultrasmooth surface with …
Effect of micro-bubbles on coagulation flotation process of dyeing wastewater
S Liu, Q Wang, H Ma, P Huang, J Li… - Separation and purification …, 2010 - Elsevier
In order to enhance the pretreatment effect of dyeing wastewater, comparison experiments
of coagulation micro-bubble floatation and coagulation conventional air bubble flotation …
of coagulation micro-bubble floatation and coagulation conventional air bubble flotation …
Nanoparticles in wastewaters: Hazards, fate and remediation
Y Liu, M Tourbin, S Lachaize, P Guiraud - Powder technology, 2014 - Elsevier
The increasing use of nanoparticles will inevitably result in their release into the aquatic
environment and thereby cause the exposure of living organisms. Due to their larger surface …
environment and thereby cause the exposure of living organisms. Due to their larger surface …
Role of co-existing ions in the removal of dissolved silica by ceramic nanofiltration membrane
Even low concentrations of nano-sized silica particles should be effectively removed from
chemical mechanical polishing (CMP) wastewater as they can corrode the pipes in …
chemical mechanical polishing (CMP) wastewater as they can corrode the pipes in …
A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits
H Yan, X Niu, M Qu, F Luo, N Zhan, J Liu… - The International Journal …, 2023 - Springer
When the integrated circuit (IC) feature size is reduced to 0.13 μm and below, copper (Cu)
becomes the new wiring material in interconnect materials. The double damascene process …
becomes the new wiring material in interconnect materials. The double damascene process …