20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

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Current Advances and Outlooks in Hybrid Bonding

JH Lau - IEEE Transactions on Components, Packaging and …, 2025 - ieeexplore.ieee.org
In this study, the recent advances and trends of Cu–Cu hybrid bonding (HB) will be
investigated. Emphasis is placed on the design, materials, process, fabrications, reliability …
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