With the development of energy science and electronic technology, interfacial thermal
transport has become a key issue for nanoelectronics, nanocomposites, energy …

Thermal boundary conductance is typically positively correlated with interfacial adhesion at
the interface. Here, we demonstrate a counterintuitive experimental result in which a weak …

Due to their exceptional electrical, thermal, and optical properties, low-dimensional (LD)
materials are very promising for many applications, such as nanoelectronic devices, energy …

Advances in nanotechnology have facilitated the exploration of submicron thermal transport.
At this scale, Fourier's law is no longer applicable, and the governing equation for thermal …

Effective heat dissipation is the bottleneck problem for the development and
commercialization of GaN-based high-power electronic and photonic devices. To address …

Particle-filled composite materials have been widely used as thermal interface materials
(TIMs) to reduce the thermal contact resistance. For industrial applications, the particle-filled …

Thermal conductivity modulations of amorphous silica through nanopore engineering are
essential for performance improvement of many devices in practical applications. The …

To achieve high device performance and high reliability for the gallium nitride (GaN)-based
high electron mobility transistors (HEMTs), efficient heat dissipation is important but remains …

Phonon surface scattering is of great importance for understanding thermal transport in
nanostructured materials and has been widely utilized to tailor thermal properties. However …

Proper consideration of anharmonicity is important for the calculation of thermal conductivity.
However, how the anharmonicity influences the thermal conduction in amorphous materials …