Three-dimensional integrated circuits (3-D IC) technology has emerged in the past few
decades, driven in part by the techno-economic difficulties of dimensional scaling and the …

In an effort to increase processor speeds, 3D IC architecture is being aggressively pursued
by researchers and chip manufacturers. This architecture allows extremely high level of …

2011-12-06 Assigned to MONOLITHIC 3D INC. reassignment MONOLITHIC 3D INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

Wavy channels were investigated in this paper as a passive scheme to improve the heat
transfer performance of laminar fluid flow as applied to microchannel heat sinks. Parametric …

US10515981B2 - Multilevel semiconductor device and structure with memory - Google
Patents US10515981B2 - Multilevel semiconductor device and structure with memory …

This study is part of two studies conducted for develo** artificial neural-network-based
tools for predicting the thermal and hydraulic performance of micro-pin fin heat sinks used …

US8642416B2 - Method of forming three dimensional integrated circuit devices using layer
transfer technique - Google Patents US8642416B2 - Method of forming three dimensional …

US8362482B2 - Semiconductor device and structure - Google Patents US8362482B2 -
Semiconductor device and structure - Google Patents Semiconductor device and structure Info …

Modern electronics advance through high integration and increased power density, yet
intricate thermal management techniques for high-power density chips limit the downsizing …

Power dissipation in microprocessors is projected to reach a level that may necessitate chip-
level liquid cooling in the near future. An on-chip microchannel heat sink can reduce the …