Low temperature interfacial reaction in 3D IC nanoscale materials

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In situ epitaxial thickening of wafer-scale, highly oriented nanotwinned Ag on tailored polycrystalline Cu substrates

X Zhan, Z Zhu - Acta Materialia, 2024 - Elsevier
Abstract Highly (111)-oriented nanotwinned Ag (nt-Ag) is a promising candidate for a next-
generation direct metal bonding material without a vacuum environment. However …
Shrani Navedi Navedeno v 5 virih Sorodni članki Vse različice: 2

Stored energy density solution for TSV-Cu structure deformation under thermal cyclic loading based on PINN

H Qian, J Shen, Z Huang, J Wang, Q Zhu… - International Journal of …, 2024 - Elsevier
TSV-Cu is widely used for chip interconnects, where high testing costs and complex crystal
plasticity finite element (CPFE) limit the research of its deep microplastic evolution process …
Shrani Navedi Navedeno v 4 virih Sorodni članki

Fatigue behaviour analysis of thermal cyclic loading for through-silicon via structures based on backstress stored energy density

H Qian, Z Huang, H Fan, Y Wang, L Cao, Q Zhu… - International Journal of …, 2024 - Elsevier
Through-silicon via (TSV) structures are widely used in microelectronic due to the ease of
chip interconnection. Few research has focused on investigating the fatigue properties of …
Shrani Navedi Navedeno v 9 virih Sorodni članki

Cu–Cu direct bonding in air by in-situ reduction of copper oxide with glycerol

X Wang, S Han, F ** miniaturized and high-performance microwave modules. Herein …
Shrani Navedi Navedeno v 2 virih Sorodni članki Vse različice: 3