Breast cancer is categorized as the most widespread cancer type among women globally.
On‐time diagnosis can decrease the mortality rate by making the right decision in the …

The synthesis, characterization, and application of carbon nanotubes (CNTs) have long
posed significant challenges due to the inherent multiple complexity nature involved in their …

With the continuous miniaturization of electronic devices and the upcoming new
technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation …

Along with deep scaling transistors and complex electronics information exchange networks,
very-large-scale-integrated (VLSI) circuits require high performance and ultra-low power …

Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for
achieving high-density integration, high-speed connectivity, and for downsizing of electronic …

Optimizing a high-quality leveler has become the core task in develo** the microvia
copper filling technology. In this work, two nitrogen-containing heterocyclic compounds …

Copper filled through silicon via (TSV-Cu) is a crucial technology for chip stacking and three-
dimensional (3D) vertical packaging. The multiple thermal loadings caused by the annealing …

Metal/carbon nanotube (CNT) composites are promising functional materials due to the
various superior properties of CNTs in addition to the characteristics of metals, and …

ABSTRACT Three-dimensional (3D) heterogeneous integration has shown great promise in
increasing integration density and reducing parasitic capacitance, which micro through vias …

We experimentally establish for the first time the influence of oxygen at carbon nanotube
(CNT)-Cu interface on CNT/Cu composite electrical performances. We fabricated CNT/Cu …