Technological advancements and the emphasis on reducing the use of hazardous
materials, such as Pb, have led to the widely use of Sn-based Pb-free solder in advanced …

Tin-based alloys are commonly used in lead-free solder joints in electronic interconnection
applications, where creep can limit joint reliability. In this work, directionally solidified bulk …

Subgrains and recrystallisation are common microstructural features in solder joints that
have been subjected to thermal fatigue or mechanical loading. Here we study similar …

Sn–Ag solders are widely used for advanced electronic packaging. The combined effect of
Ag element and temperature gradient (TG) on the formation of Sn grains in Cu/Sn-xAg/Cu …

Low-melting metal alloys have gained renewed attention for additive manufacturing, energy
storage and microelectronics. However, micro-and nanostructure characterisation demands …

The experimental and multi-scale numerical investigation for solder ball under shear loads
is studied in the present work. Shear tests are conducted on Sn-1.0 Ag-0.5 Cu solder balls at …

Micro solder joints experience various loads during operation, and the failure of a single
micro solder joint can impact the overall reliability of the entire microsystem. This study …

The microstructure of electronic solder joints is generated by the solidification of a small
volume of bulk undercooled liquid. Here, we study β-Sn dendrite growth in Sn–3Ag–0.5 Cu …

Abstract The Sn-1.0 Ag-0.5 Cu-xBi solder joints with different Bi content were prepared by
reflow soldering. The shear strength, intermetallic compound layer, and fatigue evolution in …

The reliability and performance of solder ball joints are critical factors affecting the durability
and functionality of electronic parts. This study investigates the relationship between metal …