It is essential to understand the formation and evolution mechanism of intermetallic
compounds (IMCs) in friction stir welding (FSW) of dissimilar Al/Mg alloys to mitigate the …

A data-driven approach combining together the experimental laser soldering, finite element
analysis and machine learning, has been utilized to predict the morphology of interfacial …

In Pb-free solder alloys used in solder balls of diameter of 50 µm or smaller, larger
proportion of Cu 6 Sn 5 intermetallics formation is a major reliability concern, and this is …

The 3D microstructure around a tin whisker, and its evolution during heat treatment were
studied using scanning 3DXRD. The shape of each grain in the sample was reconstructed …

Both the formation of voids and the growth of a Cu 3 Sn layer were suppressed during
reactive diffusion between Sn-0.7% Cu solder and Ni added Cu substrates compared with …

Currently, in the era of big data and 5G communication technology, electromigration has
become a serious reliability issue for the miniaturized solder joints used in microelectronic …

Most micro-electro-mechanical systems (MEMS) devices contain fragile moving parts, which
poses challenges in process integration of interconnection methods requiring wet-chemistry …

In this article, we aim to study the problem of the growth of intermetallic phases in solder
joints undergoing mechanical deformation, using a phase-field model for multi-phase …

Microstructure of interfacial intermetallics plays an important role in determining the service
performance and reliability of interconnects especially due to the anisotropic properties of …

This paper presents a sharp interface formulation for modelling diffusional phase
transformations. Grain boundary motion is, in accordance with diffusional phase …